R5F21324ANSP#U1 Renesas Electronics America, R5F21324ANSP#U1 Datasheet - Page 532

• Manufacturer Part Number: R5F21324ANSP#U1
• Description: MCU 1KB FLASH 16K ROM 20-LSSOP
• Manufacturer: Renesas Electronics America
• Series: R8C/3x/32Ar

Specifications of R5F21324ANSP#U1

• Core Processor: R8C
• Core Size: 16/32-Bit
• Speed: 20MHz
• Connectivity: I²C, LIN, SIO, SSU, UART/USART
• Peripherals: POR, PWM, Voltage Detect, WDT
• Number Of I /o: 15
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 1.5K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 85°C
• Package / Case: 20-LSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Under development
R8C/32A Group
REJ09B0458-0020 Rev.0.20
Page 502 of 583
Figure 30.5
30.4.9
When the program ROM area is specified while a program or block erase operation to the data flash, array data
can be read. This eliminates the need for writing software commands. Access time is the same as for normal
read operations.
Figure 30.5 shows the BGO Function.
Data flash
Program ROM
BGO (BackGround Operation) Function
Preliminary specification
Specifications in this manual are tentative and subject to change.
BGO Function
Nov 05, 2008
Read
Read
Erase/program
Read
Read
Time
30. Flash Memory