ST10F269-T3 STMicroelectronics, ST10F269-T3 Datasheet - Page 2

• Manufacturer Part Number: ST10F269-T3
• Manufacturer: STMicroelectronics

Specifications of ST10F269-T3

• Cpu Family: ST10
• Device Core Size: 16b
• Frequency (max): 32MHz
• Interface Type: ASC/I2C/SSC
• Program Memory Type: Flash
• Program Memory Size: 256KB
• Total Internal Ram Size: 12KB
• # I/os (max): 111
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 4.5V
• On-chip Adc: 16-chx10-bit
• Instruction Set Architecture: CISC/RISC
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: TQFP
• Lead Free Status / Rohs Status: Supplier Unconfirmed

ST10F269-T3
TABLE OF CONTENTS
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2 -
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5 -
5.1 -
5.2 -
5.3 -
5.3.1 -
5.3.2 -
5.3.3 -
5.3.4 -
5.3.5 -
5.3.6 -
5.3.7 -
5.4 -
5.5 -
5.5.1 -
5.5.2 -
5.5.3 -
5.6 -
5.6.1 -
5.6.2 -
5.6.3 -
5.6.4 -
5.6.5 -
6 -
6.1 -
6.1.1 -
6.1.1.1 -
6.1.1.2 -
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6.2 -
6.3 -
7 -
7.1 -
7.2 -
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ARCHITECTURAL DESCRIPTION ............................................................................
INTRODUCTION ........................................................................................................
PIN DATA ...................................................................................................................
FUNCTIONAL DESCRIPTION ...................................................................................
MEMORY ORGANIZATION .......................................................................................
INTERNAL FLASH MEMORY ...................................................................................
OVERVIEW ................................................................................................................
OPERATIONAL OVERVIEW ......................................................................................
Read Mode .................................................................................................................
Command Mode .........................................................................................................
Ready/Busy Signal .....................................................................................................
Flash Status Register .................................................................................................
Flash Protection Register ...........................................................................................
Instructions Description ..............................................................................................
Reset Processing and Initial State ..............................................................................
FLASH MEMORY CONFIGURATION ........................................................................
APPLICATION EXAMPLES .......................................................................................
Handling of Flash Addresses ......................................................................................
Basic Flash Access Control ........................................................................................
Programming Examples .............................................................................................
BOOTSTRAP LOADER ............................................................................................
Entering the Bootstrap Loader ....................................................................................
Memory Configuration After Reset .............................................................................
Loading the Startup Code ...........................................................................................
Exiting Bootstrap Loader Mode ..................................................................................
Choosing the Baud Rate for the BSL .........................................................................
CENTRAL PROCESSING UNIT (CPU) .....................................................................
MULTIPLIER-ACCUMULATOR UNIT (MAC) .............................................................
Features .....................................................................................................................
Enhanced Addressing Capabilities..............................................................................
Multiply-Accumulate Unit .............................................................................................
Program Control ..........................................................................................................
INSTRUCTION SET SUMMARY ................................................................................
MAC COPROCESSOR SPECIFIC INSTRUCTIONS .................................................
EXTERNAL BUS CONTROLLER ..............................................................................
PROGRAMMABLE CHIP SELECT TIMING CONTROL ............................................
READY PROGRAMMABLE POLARITY .....................................................................
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