ST10F269-T3 STMicroelectronics, ST10F269-T3 Datasheet - Page 42
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ST10F269-T3
Manufacturer Part Number
ST10F269-T3
Description
Manufacturer
STMicroelectronics
Datasheet
1.ST10F269-T3.pdf
(162 pages)
Specifications of ST10F269-T3
Cpu Family
ST10
Device Core Size
16b
Frequency (max)
32MHz
Interface Type
ASC/I2C/SSC
Program Memory Type
Flash
Program Memory Size
256KB
Total Internal Ram Size
12KB
# I/os (max)
111
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
4.5V
On-chip Adc
16-chx10-bit
Instruction Set Architecture
CISC/RISC
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
144
Package Type
TQFP
Lead Free Status / Rohs Status
Supplier Unconfirmed
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ST10F269-T3
7 - EXTERNAL BUS CONTROLLER
All of the external memory accesses are
performed by the on-chip external bus controller.
The EBC can be programmed to single chip mode
when no external memory is required, or to one of
four different external memory access modes:
– 16- / 18- / 20- / 24-bit addresses and 16-bit data,
– 16- / 18- / 20- / 24-bit addresses and 16-bit data,
– 16- / 18- / 20- / 24-bit addresses and 8-bit data,
– 16- / 18- / 20- / 24-bit addresses and 8-bit data,
In demultiplexed bus modes addresses are output
on PORT1 and data is input / output on PORT0 or
P0L, respectively. In the multiplexed bus modes
both addresses and data use PORT0 for input /
output.
Timing characteristics
interface (memory cycle time, memory tri-state
time, length of ALE and read / write delay) are
programmable giving the choice of a wide range
of memories and external peripherals.
Up to 4 independent address windows may be
defined (using register pairs ADDRSELx /
BUSCONx) to access different resources and bus
characteristics.
These
hierarchically
BUSCON3 and BUSCON2 overrides BUSCON1.
All accesses to locations not covered by these 4
address windows are controlled by BUSCON0.
Up to 5 external CS signals (4 windows plus
default) can be generated in order to save external
glue logic. Access to very slow memories is
supported by a ‘Ready’ function.
A HOLD / HLDA protocol is available for bus
arbitration which shares external resources with
other bus masters.
The bus arbitration is enabled by setting bit
HLDEN in register PSW. After setting HLDEN
once, pins P6.7...P6.5 (BREQ, HLDA, HOLD) are
automatically controlled by the EBC. In master
mode (default after reset) the HLDA pin is an
output. By setting bit DP6.7 to’1’ the slave mode is
selected where pin HLDA is switched to input.
This directly connects the slave controller to
another master controller without glue logic.
42/162
demultiplexed
multiplexed
multiplexed
demultiplexed
address
where
windows
of the
BUSCON4
are
external bus
overrides
arranged
For applications which require less external
memory space, the address space can be
restricted to 1M Byte, 256K Bytes or to 64K Bytes.
Port 4 outputs all 8 address lines if an address
space of 16M Bytes is used, otherwise four, two or
no address lines.
Chip select timing can be made programmable.
By default (after reset), the CSx lines change half
a CPU clock cycle after the rising edge of ALE.
With the CSCFG bit set in the SYSCON register
the CSx lines change with the rising edge of ALE.
The active level of the READY pin can be set by bit
RDYPOL in the BUSCONx registers. When the
READY function is enabled for a specific address
window, each bus cycle within the window must
be terminated with the active level defined by bit
RDYPOL in the associated BUSCON register.
7.1 - Programmable Chip Select Timing
Control
The ST10F269-T6 allows the user to adjust the
position of the CSx line changes. By default (after
reset), the CSx lines change half a CPU clock
cycle (31.25ns at 32MHz of CPU clock) after the
rising edge of ALE. With the CSCFG bit set in the
SYSCON register the CSx lines change with the
rising edge of ALE, thus the CSx lines and the
address lines change at the same time (see
Figure 11).
7.2 - READY Programmable Polarity
The active level of the READY pin can be selected
by software via the RDYPOL bit in the BUSCONx
registers.
When the READY function is enabled for a
specific address window, each bus cycle within
this window must be terminated with the active
level defined by this RDYPOL bit in the associated
BUSCON register.
BUSCONx registers are described in Section 20.2
- System Configuration Registers.
Note
ST10F269-T3 as no internal pull-up
resistor on READY pin.