LPC2925FBD100,551 NXP Semiconductors, LPC2925FBD100,551 Datasheet - Page 54

• Manufacturer Part Number: LPC2925FBD100,551
• Description: IC ARM9 MCU FLASH 512KB 100-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2900r

Specifications of LPC2925FBD100,551

• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 125MHz
• Connectivity: CAN, I²C, LIN, SPI, UART/USART, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 60
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 16K x 8
• Ram Size: 40K x 8
• Voltage - Supply (vcc/vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 16x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Processor Series: LPC29
• Core: ARM968E-S
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935287116551

NXP Semiconductors
Table 30.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
[4]
[5]
[6]
[7]
LPC2921_23_25_3
Product data sheet
Symbol
ESD
V
ESD
Based on package heat transfer, not device power consumption.
Peak current must be limited at 25 times average current.
For I/O Port 0, the maximum input voltage is defined by V
Only when V
Note that pull-up should be off. With pull-up do not exceed 3.6 V.
112 mA per V
Human-body model: discharging a 100 pF capacitor via a 10 kΩ series resistor.
Limiting values
DD(IO)
Parameter
electrostatic discharge
voltage
DD(IO)
is present.
or V
SS(IO)
…continued
should not be exceeded.
All information provided in this document is subject to legal disclaimers.
Conditions
on all pins
on corner pins
human body model
charged device model
charged device model
Rev. 03 — 14 April 2010
I(ADC)
.
ARM9 microcontroller with CAN, LIN, and USB
LPC2921/2923/2925
[7]
Min
−2000
−500
−750
Max
+2000
+500
+750
© NXP B.V. 2010. All rights reserved.
Unit
V
V
V
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