LPC2925FBD100,551 NXP Semiconductors, LPC2925FBD100,551 Datasheet - Page 61

• Manufacturer Part Number: LPC2925FBD100,551
• Description: IC ARM9 MCU FLASH 512KB 100-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2900r

Specifications of LPC2925FBD100,551

• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 125MHz
• Connectivity: CAN, I²C, LIN, SPI, UART/USART, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 60
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 16K x 8
• Ram Size: 40K x 8
• Voltage - Supply (vcc/vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 16x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Processor Series: LPC29
• Core: ARM968E-S
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935287116551

NXP Semiconductors
LPC2921_23_25_3
Product data sheet
8.2 Electrical pin characteristics
Fig 17.
Fig 18. Typical LOW-level output voltage versus LOW-level output current
I
DD(CORE)
(mA)
(mV)
V
OL
500
400
300
200
100
Conditions: active mode entered executing code from flash; core voltage 1.8 V; all peripherals
enabled but not configured to run.
V
80
60
40
20
I
0
DD(CORE)
0
−40
DD(IO)
1.0
= 3.3 V.
All information provided in this document is subject to legal disclaimers.
125 MHz
100 MHz
at different temperatures (active mode)
80 MHz
40 MHz
10 MHz
Rev. 03 — 14 April 2010
−15
2.0
3.0
10
−40 °C
85 °C
25 °C
ARM9 microcontroller with CAN, LIN, and USB
0 °C
LPC2921/2923/2925
4.0
35
5.0
60
temperature (°C)
I
OL
(mA)
002aae239
002aae689
© NXP B.V. 2010. All rights reserved.
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