LPC2925FBD100,551 NXP Semiconductors, LPC2925FBD100,551 Datasheet - Page 84

IC ARM9 MCU FLASH 512KB 100-LQFP

LPC2925FBD100,551

Manufacturer Part Number
LPC2925FBD100,551
Description
IC ARM9 MCU FLASH 512KB 100-LQFP
Manufacturer
NXP Semiconductors
Series
LPC2900r
Datasheet

Specifications of LPC2925FBD100,551

Core Processor
ARM9
Core Size
32-Bit
Speed
125MHz
Connectivity
CAN, I²C, LIN, SPI, UART/USART, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
60
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Eeprom Size
16K x 8
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
1.71 V ~ 3.6 V
Data Converters
A/D 16x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Processor Series
LPC29
Core
ARM968E-S
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935287116551

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC2925FBD100,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
6.15
6.15.1
6.15.2
6.15.2.1
6.15.2.2
6.15.2.3
6.15.3
6.15.3.1
6.15.4
6.15.4.1
6.15.4.2
6.15.5
6.15.5.1
6.16
6.16.1
6.16.2
7
8
8.1
8.2
9
9.1
9.2
9.3
9.4
9.5
9.6
10
10.1
10.2
10.3
10.4
10.5
11
12
12.1
12.2
12.3
12.4
13
14
15
16
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 53
Static characteristics. . . . . . . . . . . . . . . . . . . . 55
Dynamic characteristics . . . . . . . . . . . . . . . . . 64
Application information. . . . . . . . . . . . . . . . . . 70
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 75
Soldering of SMD packages . . . . . . . . . . . . . . 76
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 79
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 80
Legal information. . . . . . . . . . . . . . . . . . . . . . . 81
Power, Clock, and Reset control SubSystem
(PCRSS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Vectored interrupt controller . . . . . . . . . . . . . . 51
Dynamic characteristics: I/O and CLK_OUT
pins, internal clock, oscillators, PLL, and
CAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Dynamic characteristics: I
Dynamic characteristics: flash memory and
EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
layout guidelines . . . . . . . . . . . . . . . . . . . . . . . 74
Wave and reflow soldering . . . . . . . . . . . . . . . 76
Clock description . . . . . . . . . . . . . . . . . . . . . . 41
Clock Generation Unit (CGU0) . . . . . . . . . . . . 42
Functional description. . . . . . . . . . . . . . . . . . . 42
PLL functional description . . . . . . . . . . . . . . . 45
Pin description . . . . . . . . . . . . . . . . . . . . . . . . 46
Clock generation for USB (CGU1) . . . . . . . . . 47
Pin description . . . . . . . . . . . . . . . . . . . . . . . . 47
Reset Generation Unit (RGU). . . . . . . . . . . . . 47
Functional description. . . . . . . . . . . . . . . . . . . 48
Pin description . . . . . . . . . . . . . . . . . . . . . . . . 48
Power Management Unit (PMU). . . . . . . . . . . 49
Functional description. . . . . . . . . . . . . . . . . . . 49
Functional description. . . . . . . . . . . . . . . . . . . 51
Clock description . . . . . . . . . . . . . . . . . . . . . . 52
Power consumption . . . . . . . . . . . . . . . . . . . . 60
Electrical pin characteristics . . . . . . . . . . . . . . 61
USB interface . . . . . . . . . . . . . . . . . . . . . . . . . 66
Dynamic characteristics: SPI . . . . . . . . . . . . . 68
Dynamic characteristics: ADC1/2 . . . . . . . . . 70
Operating frequency selection . . . . . . . . . . . . 70
Suggested USB interface solutions . . . . . . . . 71
SPI signal forms . . . . . . . . . . . . . . . . . . . . . . . 72
XIN_OSC input . . . . . . . . . . . . . . . . . . . . . . . . 74
XIN_OSC Printed Circuit Board (PCB)
Introduction to soldering . . . . . . . . . . . . . . . . . 76
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 76
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 77
2
C-bus interface. . . 67
16.1
16.2
16.3
16.4
17
18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
ARM9 microcontroller with CAN, LIN, and USB
Contact information . . . . . . . . . . . . . . . . . . . . 82
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 81
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 82
LPC2921/2923/2925
Document identifier: LPC2921_23_25_3
Date of release: 14 April 2010
All rights reserved.

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