LPC2925FBD100,551 NXP Semiconductors, LPC2925FBD100,551 Datasheet - Page 78

• Manufacturer Part Number: LPC2925FBD100,551
• Description: IC ARM9 MCU FLASH 512KB 100-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2900r

Specifications of LPC2925FBD100,551

• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 125MHz
• Connectivity: CAN, I²C, LIN, SPI, UART/USART, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 60
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 16K x 8
• Ram Size: 40K x 8
• Voltage - Supply (vcc/vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 16x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Processor Series: LPC29
• Core: ARM968E-S
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935287116551

NXP Semiconductors
LPC2921_23_25_3
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
Fig 33. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
All information provided in this document is subject to legal disclaimers.
Rev. 03 — 14 April 2010
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
ARM9 microcontroller with CAN, LIN, and USB
LPC2921/2923/2925
temperature
peak
© NXP B.V. 2010. All rights reserved.
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