LPC2925FBD100,551 NXP Semiconductors, LPC2925FBD100,551 Datasheet - Page 64

IC ARM9 MCU FLASH 512KB 100-LQFP

LPC2925FBD100,551

Manufacturer Part Number
LPC2925FBD100,551
Description
IC ARM9 MCU FLASH 512KB 100-LQFP
Manufacturer
NXP Semiconductors
Series
LPC2900r
Datasheet

Specifications of LPC2925FBD100,551

Core Processor
ARM9
Core Size
32-Bit
Speed
125MHz
Connectivity
CAN, I²C, LIN, SPI, UART/USART, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
60
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Eeprom Size
16K x 8
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
1.71 V ~ 3.6 V
Data Converters
A/D 16x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Processor Series
LPC29
Core
ARM968E-S
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935287116551

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC2925FBD100,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
9. Dynamic characteristics
Table 33.
V
ground; positive currents flow into the IC; unless otherwise specified.
[1]
[2]
[3]
[4]
LPC2921_23_25_3
Product data sheet
Symbol
I/O pins
t
t
CLK_OUT pin
f
Internal clock
f
T
Low-power ring oscillator
f
t
Oscillator
f
t
PLL
f
f
t
t
Jitter specification for CAN
t
THL
TLH
clk
clk(sys)
ref(RO)
startup
i(osc)
startup
i(PLL)
o(PLL)
a(clk)
a(A)
jit(cc)(p-p)
DD(CORE)
clk(sys)
All parameters are guaranteed over the virtual junction temperature range by design. Pre-testing is performed at T
temperature on wafer level. Cased products are tested at T
test conditions to cover the specified temperature and power supply voltage range.
See
This parameter is not part of production testing or final testing, hence only a typical value is stated.
Oscillator start-up time depends on the quality of the crystal. For most crystals it takes about 1000 clock pulses until the clock is fully
stable.
Table
= V
Dynamic characteristics
DD(OSC_PLL)
24.
9.1 Dynamic characteristics: I/O and CLK_OUT pins, internal clock,
Parameter
HIGH to LOW
transition time
LOW to HIGH
transition time
clock frequency
system clock
frequency
system clock period
RO reference
frequency
start-up time
oscillator input
frequency
start-up time
PLL input frequency
PLL output frequency
clock access time
address access time
cycle to cycle jitter
(peak-to-peak value)
oscillators, PLL, and CAN
; V
DD(IO)
= 2.7 V to 3.6 V; V
All information provided in this document is subject to legal disclaimers.
Conditions
C
C
on pin CLK_OUT
maximum frequency is the
clock input of an external
clock source applied to the
XIN_OSC pin
CCO; direct mode
on CAN TXDC pin
at maximum frequency
at maximum frequency
L
L
= 30 pF
= 30 pF
Rev. 03 — 14 April 2010
DDA(ADC3V3)
amb
= 25 °C (final testing). Both pre-testing and final testing use correlated
= 3.0 V to 3.6 V; all voltages are measured with respect to
[1]
ARM9 microcontroller with CAN, LIN, and USB
[2]
[2]
[3]
[3]
[4]
[3]
Min
4
4
-
10
8
0.4
-
10
-
10
10
156
-
-
-
LPC2921/2923/2925
Typ
-
-
-
-
-
0.5
6
-
500
-
-
-
-
-
0.4
Max
13.8
13.8
40
125
100
0.6
-
100
-
25
160
320
63.4
60.3
1
© NXP B.V. 2010. All rights reserved.
amb
= 85 °C ambient
Unit
ns
ns
MHz
MHz
ns
MHz
μs
MHz
μs
MHz
MHz
MHz
ns
ns
ns
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