LPC2925FBD100,551 NXP Semiconductors, LPC2925FBD100,551 Datasheet - Page 70

• Manufacturer Part Number: LPC2925FBD100,551
• Description: IC ARM9 MCU FLASH 512KB 100-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2900r

Specifications of LPC2925FBD100,551

• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 125MHz
• Connectivity: CAN, I²C, LIN, SPI, UART/USART, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 60
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 16K x 8
• Ram Size: 40K x 8
• Voltage - Supply (vcc/vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 16x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Processor Series: LPC29
• Core: ARM968E-S
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935287116551

NXP Semiconductors
Table 39.
V
ground.
[1]
[2]
10. Application information
LPC2921_23_25_3
Product data sheet
Symbol
f
f
t
i(ADC)
s(max)
conv
DD(CORE)
All parameters are guaranteed over the virtual junction temperature range by design. Pre-testing is performed at T
temperature on wafer level. Cased products are tested at T
test conditions to cover the specified temperature and power supply voltage range.
Duty cycle clock should be as close as possible to 50 %.
[1]
= V
ADC dynamic characteristics
DD(OSC_PLL)
Parameter
ADC input frequency
maximum sampling rate
conversion time
10.1 Operating frequency selection
9.6 Dynamic characteristics: ADC1/2
The LPC2921/2923/2925 is specified to operate at a maximum frequency of 125 MHz,
maximum temperature of 85 °C, and maximum core voltage of 1.89 V.
Figure 26
LPC2921/2923/2925 by controlling the temperature and the core voltage accordingly.
; V
Fig 25. Core operating frequency versus temperature for different core voltages
DD(IO)
frequency
(MHz)
core
= 2.7 V to 3.6 V; V
145
135
125
115
105
show that the user can achieve higher operating frequencies for the
25
All information provided in this document is subject to legal disclaimers.
Conditions
f
f
n = resolution
In number of ADC
clock cycles
In number of bits
i(ADC)
s
V
= f
resolution 2 bit
resolution 10 bit
DD(CORE)
V
V
DD(CORE)
DD(CORE)
i(ADC)
= 4.5 MHz;
Rev. 03 — 14 April 2010
DDA(ADC3V3)
/ (n + 1) with
= 1.65 V
= 1.95 V
= 1.8 V
amb
= 25 °C (final testing). Both pre-testing and final testing use correlated
45
= 3.0 V to 3.6 V; all voltages are measured with respect to
ARM9 microcontroller with CAN, LIN, and USB
[2]
Min
4
-
-
3
2
LPC2921/2923/2925
65
Typ
-
-
-
-
-
temperature (°C)
Max
4.5
1500 ksample/s
400
11
10
Figure 25
002aae194
© NXP B.V. 2010. All rights reserved.
amb
= 85 °C ambient
85
Unit
MHz
ksample/s
cycles
bits
and
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