HD6417712BPV Renesas Electronics America, HD6417712BPV Datasheet - Page 373

MPU 1.5/3.3V 0K PB-FREE 256-BGA

HD6417712BPV

Manufacturer Part Number
HD6417712BPV
Description
MPU 1.5/3.3V 0K PB-FREE 256-BGA
Manufacturer
Renesas Electronics America
Series
SuperH® SH Ethernetr
Datasheet

Specifications of HD6417712BPV

Core Processor
SH-3 DSP
Core Size
32-Bit
Speed
200MHz
Connectivity
EBI/EMI, Ethernet, FIFO, SCI, SIO
Peripherals
DMA, POR, WDT
Number Of I /o
24
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
256-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6417712BPV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
11.9
When Using an External Crystal Resonator: Place the crystal resonator, capacitors CL1 and
CL2, and damping resistor R close to the EXTAL and XTAL pins. To prevent induction from
interfering with correct oscillation, use a common grounding point for the capacitors connected to
the resonator, and do not locate a wiring pattern near these components.
Bypass Capacitors: Insert a laminated ceramic capacitor as a bypass capacitor for each Vss/VssQ
and Vcc/VccQ pair. Mount the bypass capacitors to the power supply pins, and use components
with a frequency characteristic suitable for the operating frequency of the LSI, as well as a suitable
capacitance value.
Pin assignments of HQFP2828-256 (FP-256G/GV)
Vss/VssQ and Vcc/VccQ pair of digital circuitry
3 and 4, 13 and 14, 15 and 16, 25 and 26, 35 and 36, 43 and 44, 49 and 50, 57 and 58, 72 and
73, 81 and 82, 83 and 84, 92 and 93, 99 and 100, 107 and 108, 113 and 114, 121 and 122, 136
and 137, 146 and 147, 148 and 149, 158 and 159, 167 and 168, 176 and 177, 185 and 186, 191
and 192, 206 and 207, 208 and 209, 221 and 222, 227 and 228, 235 and 236, 241 and 242
Vss/VssQ and Vcc/VccQ pair of the on-chip oscillator
193 and 196, 251 and 252, 253 and 254
Note: The values for CL1, CL2, and the damping resistance should be determined after
Notes on Board Design
consultation with the crystal manufacturer.
Figure 11.4 Points for Attention when Using Crystal Resonator
EXTAL
Avoid crossing
signal lines
CL1
This LSI
CL2
XTAL
R
Rev. 1.00 Dec. 27, 2005 Page 329 of 932
Section 11 On-Chip Oscillation Circuits
REJ09B0269-0100

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