HD6417712BPV Renesas Electronics America, HD6417712BPV Datasheet - Page 927

MPU 1.5/3.3V 0K PB-FREE 256-BGA

HD6417712BPV

Manufacturer Part Number
HD6417712BPV
Description
MPU 1.5/3.3V 0K PB-FREE 256-BGA
Manufacturer
Renesas Electronics America
Series
SuperH® SH Ethernetr
Datasheet

Specifications of HD6417712BPV

Core Processor
SH-3 DSP
Core Size
32-Bit
Speed
200MHz
Connectivity
EBI/EMI, Ethernet, FIFO, SCI, SIO
Peripherals
DMA, POR, WDT
Number Of I /o
24
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
256-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6417712BPV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
(Bank Active Mode, ACTV + READ Commands, CAS Latency = 2, TRCD = 1 Cycle)
Figure 24.30 Synchronous DRAM Burst Read Bus Cycle (Single Read × 4)
A12/A11 *
D31 to D0
A25 to A0
DACKn *
RD/WR
DQMxx
CKIO
RAS
CAS
CKE
CSn
BS
1
2
Notes: 1. Address pin to be connected to A10 of SDRAM.
t
t
t
t
t
t
t
AD1
AD1
CSD1
DQMD1
2. DACKn is a waveform when active-low is specified.
RWD1
RASD1
DACD
address
Tr
Row
t
t
t
t
t
AD1
AD1
BSD
RASD1
CASD1
Tc1
t
AD1
Tc2
address
Column
t
AD1
Td1
Tc3
(High)
t
Read command
RDS2
t
t
AD1
RDH2
Td2
Tc4
(1-4)
t
Rev. 1.00 Dec. 27, 2005 Page 883 of 932
t
t
BSD
AD1
CASD1
Td3
Section 24 Electrical Characteristics
Td4
t
RDS2
t
t
t
t
RDH2
DACD
CSD1
DQMD1
Tde
REJ09B0269-0100
t
t
t
AD1
AD1
RWD1

Related parts for HD6417712BPV