UPD78F0138HGK-9ET-A Renesas Electronics America, UPD78F0138HGK-9ET-A Datasheet - Page 563

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UPD78F0138HGK-9ET-A

Manufacturer Part Number
UPD78F0138HGK-9ET-A
Description
MCU 8BIT 60K FLASH 64TQFP
Manufacturer
Renesas Electronics America
Series
78K0/Kx1+r
Datasheet

Specifications of UPD78F0138HGK-9ET-A

Core Processor
78K/0
Core Size
8-Bit
Speed
16MHz
Connectivity
3-Wire SIO, LIN, UART/USART
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
42
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
On-chip
debug
function
Electrical
specifications
(standard
products, (A)
grade
products),
Electrical
specifications
((A1) grade
products)
Function
When using X1
and X2 pins
Absolute
maximum ratings
High-speed
system clock
(crystal/
ceramic)
oscillator
Recommended
oscillator
constants
PD78F0138HD The PD78F0138HD has an on-chip debug function. Do not use this product
PD78F0138HD The PD78F0138HD has an on-chip debug function. Do not use this product
Details of
Function
for mass production because its reliability cannot be guaranteed after the on-
chip debug function has been used, given the issue of the number of times
the flash memory can be rewritten. NEC Electronics does not accept
complaints concerning this product.
Input the clock from the X1 pin during on-chip debugging.
Control the X1 and X2 pins by externally pulling down the P31 pin.
for mass production because its reliability cannot be guaranteed after the on-
chip debug function has been used, given the issue of the number of times
the flash memory can be rewritten. NEC Electronics does not accept
complaints concerning this product.
Product quality may suffer if the absolute maximum rating is exceeded even
momentarily for any parameter. That is, the absolute maximum ratings are
rated values at which the product is on the verge of suffering physical
damage, and therefore the product must be used under conditions that
ensure that the absolute maximum ratings are not exceeded.
When using the crystal/ceramic oscillator, wire as follows in the area
enclosed by the broken lines in the above figures to avoid an adverse effect
from wiring capacitance.
• Keep the wiring length as short as possible.
• Do not cross the wiring with the other signal lines.
• Do not route the wiring near a signal line through which a high fluctuating
• Always make the ground point of the oscillator capacitor the same potential
• Do not ground the capacitor to a ground pattern through which a high
• Do not fetch signals from the oscillator.
Since the CPU is started by the internal oscillation clock after reset, check
the oscillation stabilization time of the high-speed system clock using the
oscillation stabilization time counter status register (OSTC). Determine the
oscillation stabilization time of the OSTC register and oscillation stabilization
time select register (OSTS) after sufficiently evaluating the oscillation
stabilization time with the resonator to be used.
The oscillator constants shown above are reference values based on
evaluation in a specific environment by the resonator manufacturer. If it is
necessary to optimize the oscillator characteristics in the actual application,
apply to the resonator manufacturer for evaluation on the implementation
circuit. The oscillation voltage and oscillation frequency only indicate the
oscillator characteristic. Use the 78K0/KE1+ so that the internal operation
conditions are within the specifications of the DC and AC characteristics.
current flows.
as V
current flows.
APPENDIX D LIST OF CAUTIONS
SS
.
User’s Manual U16899EJ3V0UD
Cautions
p. 463
p. 463
p. 463
p. 478
pp. 478,
479, 495,
496
pp. 480,
497
pp. 480,
497
p. 481
Page
(24/25)
561

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