XC2VP7-5FF672C Xilinx Inc, XC2VP7-5FF672C Datasheet - Page 12

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XC2VP7-5FF672C

Manufacturer Part Number
XC2VP7-5FF672C
Description
FPGA Virtex-II Pro™ Family 11088 Cells 1050MHz 0.13um/90nm (CMOS) Technology 1.5V 672-Pin FCBGA
Manufacturer
Xilinx Inc
Datasheet

Specifications of XC2VP7-5FF672C

Package
672FCBGA
Family Name
Virtex-II Pro™
Device Logic Units
11088
Number Of Registers
9856
Maximum Internal Frequency
1050 MHz
Typical Operating Supply Voltage
1.5 V
Maximum Number Of User I/os
396
Ram Bits
811008

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DS083 (v4.7) November 5, 2007
Virtex-II Pro
This module describes the following Virtex™-II Pro func-
tional components, as shown in
Virtex-II Pro User Guides
Virtex-II Pro User Guides cover theory of operation in more
detail, and include implementation details, primitives and
attributes, command/instruction sets, and many HDL code
examples where appropriate. All parameter specifications
are given only in
1. Unless otherwise noted, "Virtex-II Pro" refers to members of the Virtex-II Pro and/or Virtex-II Pro X families.
© 2002–2007 Xilinx, Inc. All rights reserved. XILINX, the Xilinx logo, the Brand Window, and other designated brands included herein are trademarks of Xilinx, Inc. PowerPC is
a trademark of IBM Corp. and is used under license. All other trademarks are the property of their respective owners.
DS083 (v4.7) November 5, 2007
Product Specification
Figure 1: Virtex-II Pro Generic Architecture Overview
Embedded RocketIO™ (up to 3.125 Gb/s) or
RocketIO X (up to 6.25 Gb/s) Multi-Gigabit
Transceivers (MGTs)
Processor blocks with embedded IBM PowerPC™ 405
RISC CPU core (PPC405) and integration circuitry.
FPGA fabric based on Virtex-II architecture.
SelectIO-Ultra
CLB
Module 3
(1)
DCM
Array Functional Description
Configurable
of this Data Sheet.
Logic
CLB
CLB
Multi-Gigabit Transceiver
RocketIO or RocketIO X
R
Figure
6
0
Virtex-II Pro and Virtex-II Pro X Platform FPGAs:
1:
CLB
DS083-1_01_050304
www.xilinx.com
These User Guides are available:
All of the documents above, as well as a complete listing
and description of Xilinx-developed Intellectual Property
cores for Virtex-II Pro, are available on the Xilinx website.
Contents of This Module
Virtex-II Pro Compared to Virtex-II Devices
Virtex-II Pro devices are built on the Virtex-II FPGA archi-
tecture. Most FPGA features are identical to Virtex-II
devices. Major differences are described below:
For detailed descriptions of PPC405 embedded core
programming models and internal core operations, see
PowerPC Processor Reference Guide
405 Processor Block Reference Guide
For detailed RocketIO transceiver digital/analog design
considerations, see
For detailed RocketIO X transceiver digital/analog
design considerations, see
User Guide
For detailed descriptions of the FPGA fabric (CLB, IOB,
DCM, etc.), see
Guide
Functional Description: RocketIO X Multi-Gigabit
Transceiver (MGT)
Functional Description: RocketIO Multi-Gigabit
Transceiver (MGT)
Functional Description: Processor Block
Functional Description: Embedded PowerPC 405 Core
Functional Description: FPGA
Revision History
The Virtex-II Pro FPGA family is the first to incorporate
embedded PPC405 and RocketIO/RocketIO X cores.
V
3.3V as for Virtex-II devices. Advanced processing at
0.13 μm has resulted in a smaller die, faster speed,
and lower power consumption.
Virtex-II Pro devices are neither bitstream-compatible nor
pin-compatible with Virtex-II devices. However, Virtex-II
designs can be compiled into Virtex-II Pro devices.
On-chip input LVDS differential termination is available.
SSTL3, AGP-2X/AGP, LVPECL_33, LVDS_33, and
LVDSEXT_33 standards are not supported.
The open-drain output pin TDO does not have an
internal pull-up resistor.
CCAUX
.
, the auxiliary supply voltage, is 2.5V instead of
,
Functional Description
Virtex-II Pro Platform FPGA User
RocketIO Transceiver User Guide
RocketIO X Transceiver
Product Specification
and
.
Module 2 of 4
PowerPC
.
1

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