MT41J256M8HX-15E:D Micron Technology Inc, MT41J256M8HX-15E:D Datasheet - Page 25

• Manufacturer Part Number: MT41J256M8HX-15E:D
• Description: MICMT41J256M8HX-15E:D 2GB:X4,X8,X16 DDR3
• Manufacturer: Micron Technology Inc
• Type: DDR3 SDRAMr
• Series: -r

Specifications of MT41J256M8HX-15E:D

• Organization: 256Mx8
• Address Bus: 18b
• Maximum Clock Rate: 1.333GHz
• Operating Supply Voltage (typ): 1.5V
• Package Type: FBGA
• Operating Temp Range: 0C to 95C
• Operating Supply Voltage (max): 1.575V
• Operating Supply Voltage (min): 1.425V
• Supply Current: 165mA
• Pin Count: 78
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Format - Memory: RAM
• Memory Type: DDR3 SDRAM
• Memory Size: 2G (256M x 8)
• Speed: 667MHz
• Interface: Parallel
• Voltage - Supply: 1.425 V ~ 1.575 V
• Operating Temperature: 0°C ~ 95°C
• Package / Case: 78-TFBGA
• Lead Free Status / RoHS Status: Compliant

Figure 10: 82-Ball FBGA – x4, x8; “JE“
PDF: 09005aef826aaadc/Source: 09005aef82a357c3
DDR3_D2.fm - Rev G 2/09 EN
Seating
Solder ball
material: SAC305.
Dimensions apply
to solder balls
post-reflow on
Ø0.33 NSMD
ball pads.
9.6 CTR
plane
0.12 A
82X Ø0.45
0.8 TYP
A
Notes:
11 10 9
1. All dimensions are in millimeters.
8
12.5 ±0.15
8 CTR
0.8 TYP
4
3
2
1
0.75 ±0.1
A
B
C
D
E
F
G
H
J
K
L
M
N
Ball A1 ID
15 ±0.15
25
Micron Technology, Inc., reserves the right to change products or specifications without notice.
0.25 MIN
2Gb: x4, x8, x16 DDR3 SDRAM
1.2 MAX
Ball A1 ID
Package Dimensions
©2006 Micron Technology, Inc. All rights reserved.