TMPR4937XBG-300 Toshiba, TMPR4937XBG-300 Datasheet - Page 26
TMPR4937XBG-300
Manufacturer Part Number
TMPR4937XBG-300
Description
Manufacturer
Toshiba
Datasheet
1.TMPR4937XBG-300.pdf
(552 pages)
Specifications of TMPR4937XBG-300
Family Name
TX49
Device Core Size
64b
Frequency (max)
300MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
1.5V
Operating Supply Voltage (max)
1.6V
Operating Supply Voltage (min)
1.4V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
484
Package Type
BGA
Lead Free Status / Rohs Status
Compliant
Available stocks
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Part Number:
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3.2
3.2.1
3.2.2
Moisture-proof packing should be handled with care. The handling procedure
specified for each packing type should be followed scrupulously. If the proper
procedures are not followed, the quality and reliability of devices may be degraded.
This section describes general precautions for handling moisture-proof packing. Since
the details may differ from device to device, refer also to the relevant individual
datasheets or databook.
(1) General precautions
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Storage
Avoid storage locations where devices will be exposed to moisture or direct sunlight.
Follow the instructions printed on the device cartons regarding
transportation and storage.
The storage area temperature should be kept within a temperature range
of 5°C to 35°C, and relative humidity should be maintained at between
45% and 75%.
Do not store devices in the presence of harmful (especially corrosive)
gases, or in dusty conditions.
Use storage areas where there is minimal temperature fluctuation. Rapid temperature changes can cause
moisture to form on stored devices, resulting in lead oxidation or corrosion. As a result, the solderability of
the leads will be degraded.
When repacking devices, use anti-static containers.
Do not allow external forces or loads to be applied to devices while they are in storage.
If devices have been stored for more than two years, their electrical characteristics should be tested and their
leads should be tested for ease of soldering before they are used.
Do not drop or toss device packing. The laminated aluminum material in it can be rendered ineffective by
rough handling.
The storage area temperature should be kept within a temperature range of 5°C to 30°C, and relative humidity
should be maintained at 90% (max). Use devices within 12 months of the date marked on the package seal.
General storage
Moisture-proof packing
Follow the instructions printed on the device cartons regarding transportation and storage.
3 General Safety Precautions and Usage Considerations
3-4
Humidity:
Temperature:
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