TMPR4937XBG-300 Toshiba, TMPR4937XBG-300 Datasheet - Page 37

• Manufacturer Part Number: TMPR4937XBG-300
• Manufacturer: Toshiba

Specifications of TMPR4937XBG-300

• Family Name: TX49
• Device Core Size: 64b
• Frequency (max): 300MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.5V
• Operating Supply Voltage (max): 1.6V
• Operating Supply Voltage (min): 1.4V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 484
• Package Type: BGA
• Lead Free Status / Rohs Status: Compliant

3.5.7
3.5.8
3.5.9
Devices delivered in chip form tend to degrade or break under external forces much more easily than plastic-
packaged devices. Therefore, caution is required when handling this type of device.
(1) Mount devices in a properly prepared environment so that chip surfaces will not be exposed to polluted
(2) When handling chips, be careful not to expose them to static electricity.
(3) Make sure that PCBs (or any other kind of circuit board) on which chips are being mounted do not have
(4) When mounting chips on a board, use the method of assembly that is most suitable for maintaining the
When devices are to be used in equipment requiring a high degree of reliability or in extreme environments
(where moisture, corrosive gas or dust is present), circuit boards may be coated for protection. However, before
doing so, you must carefully consider the possible stress and contamination effects that may result and then
choose the coating resin which results in the minimum level of stress to the device.
(1) When attaching a heat sink to a device, be careful not to apply excessive force to the device in the process.
(2) When attaching a device to a heat sink by fixing it at two or more locations, evenly tighten all the screws in
(3) Drill holes for screws in the heat sink exactly as specified. Smooth the surface by
(4) A coating of silicone compound can be applied between the heat sink and the device
(5) If the device is housed in a plastic package, use caution when selecting the type of silicone compound to be
(6) Heat-sink-equipped devices can become very hot during operation. Do not touch them, or you may sustain
Mounting chips
ambient air or other polluted substances.
In particular, measures must be taken to prevent static damage during the mounting of chips. With this in
mind, Toshiba recommend mounting all peripheral parts first and then mounting chips last (after all other
components have been mounted).
any chemical residues on them (such as the chemicals which were used for etching the PCBs).
appropriate electrical, thermal and mechanical properties of the semiconductor devices used.
* For details of devices in chip form, refer to the relevant device’s individual datasheets.
Circuit board coating
Heat sinks
stages (i.e. do not fully tighten one screw while the rest are still only loosely tightened). Finally, fully
tighten all the screws up to the specified torque.
removing burrs and protrusions or indentations which might interfere with the
installation of any part of the device.
to improve heat conductivity. Be sure to apply the coating thinly and evenly; do not
use too much. Also, be sure to use a non-volatile compound, as volatile compounds
can crack after a time, causing the heat radiation properties of the heat sink to
deteriorate.
applied between the heat sink and the device. With some types, the base oil separates and penetrates the
plastic package, significantly reducing the useful life of the device.
Two recommended silicone compounds in which base oil separation is not a problem are YG6260 from
Toshiba Silicone.
a burn.
3 General Safety Precautions and Usage Considerations
3-15