TMPR4937XBG-300 Toshiba, TMPR4937XBG-300 Datasheet - Page 39

• Manufacturer Part Number: TMPR4937XBG-300
• Manufacturer: Toshiba

Specifications of TMPR4937XBG-300

• Family Name: TX49
• Device Core Size: 64b
• Frequency (max): 300MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.5V
• Operating Supply Voltage (max): 1.6V
• Operating Supply Voltage (min): 1.4V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 484
• Package Type: BGA
• Lead Free Status / Rohs Status: Compliant

3.6.5
3.6.6
3.6.7
3.6.8
3.7
Devices exposed to strong magnetic fields can undergo a polarization phenomenon in their plastic material, or
within the chip, which gives rise to abnormal symptoms such as impedance changes or increased leakage
current. Failures have been reported in LSIs mounted near malfunctioning deflection yokes in TV sets. In such
cases the device’s installation location must be changed or the device must be shielded against the electrical or
magnetic field. Shielding against magnetism is especially necessary for devices used in an alternating magnetic
field because of the electromotive forces generated in this type of environment.
Light striking a semiconductor device generates electromotive force due to photoelectric effects. In some cases
the device can malfunction. This is especially true for devices in which the internal chip is exposed. When
designing circuits, make sure that devices are protected against incident light from external sources. This
problem is not limited to optical semiconductors and EPROMs. All types of device can be affected by light.
Just like corrosive gases, dust and oil can cause chemical reactions in devices, which will adversely affect a
device’s electrical characteristics. To avoid this problem, do not use devices in dusty or oily environments. This
is especially important for optical devices because dust and oil can affect a device’s optical characteristics as
well as its physical integrity and the electrical performance factors mentioned above.
Semiconductor devices are combustible; they can emit smoke and catch fire if heated sufficiently. When this
happens, some devices may generate poisonous gases. Devices should therefore never be used in close
proximity to an open flame or a heat-generating body, or near flammable or combustible materials.
When discarding unused devices and packing materials, follow all procedures specified by local regulations in
order to protect the environment against contamination.
Disposal of Devices and Packing Materials
Strong electrical and magnetic fields
Interference from light (ultraviolet rays, sunlight, fluorescent lamps and
incandescent lamps)
Dust and oil
Fire
3 General Safety Precautions and Usage Considerations
3-17