PIC16LF723A-I/ML Microchip Technology, PIC16LF723A-I/ML Datasheet - Page 283

MCU PIC 3.5K FLASH XLP 28-QFN

PIC16LF723A-I/ML

Manufacturer Part Number
PIC16LF723A-I/ML
Description
MCU PIC 3.5K FLASH XLP 28-QFN
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Datasheets

Specifications of PIC16LF723A-I/ML

Core Size
8-Bit
Program Memory Size
7KB (4K x 14)
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Core Processor
PIC
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Number Of I /o
25
Program Memory Type
FLASH
Ram Size
192 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 11x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Controller Family/series
PIC16LF
No. Of I/o's
25
Ram Memory Size
192Byte
Cpu Speed
20MHz
No. Of Timers
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
 2010 Microchip Technology Inc.
Device:
Temperature
Range:
Package:
Pattern:
PART NO.
Device
Temperature
PIC16F722A, PIC16LF722A, PIC16F722AT,
PIC16LF722AT
PIC16F723A, PIC16LF723A, PIC16F723AT,
PIC16LF723AT
I
E
MV
ML
SO
SP
SS
3-Digit Pattern Code for QTP (blank otherwise)
Range
X
= -40C to+85C
= -40C to+125C
= Micro Lead Frame (UQFN)
= Micro Lead Frame (QFN)
= SOIC
= Skinny Plastic DIP
= SSOP
(1)
(1)
Package
/XX
Pattern
XXX
PIC16F/LF722A/723A
Examples:
a)
b)
Note1:
PIC16F722A-E/SP
Temp., skinny PDIP package, QTP pat-
tern #301
PIC16F722A-I/SO = Industrial Temp.,
SOIC package
T
= In tape and reel.
.
301
DS41417A-page 283
=
Extended

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