HD6413003TF16 Renesas Electronics America, HD6413003TF16 Datasheet - Page 117

IC H8 MCU ROMLESS QFP112

HD6413003TF16

Manufacturer Part Number
HD6413003TF16
Description
IC H8 MCU ROMLESS QFP112
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD6413003TF16

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
DMA, PWM, WDT
Number Of I /o
50
Program Memory Type
ROMless
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
112-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-

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5.4.3 Interrupt Response Time
Table 5-5 indicates the interrupt response time from the occurrence of an interrupt request until
the first instruction of the interrupt service routine is executed.
Table 5-5 Interrupt Response Time
No. Item
1
2
3
4
5
6
Total
Notes: 1. 1 state for internal interrupts.
Interrupt priority decision
Maximum number of states
until end of current instruction
Saving PC and CCR to stack
Vector fetch
Instruction prefetch
Internal processing
2. Prefetch after the interrupt is accepted and prefetch of the first instruction in the interrupt
3. Internal processing after the interrupt is accepted and internal processing after prefetch.
4. The number of states increases if wait states are inserted in external memory access.
service routine.
*2
*3
On-Chip
Memory
2
1 to 23
4
4
4
4
19 to 41
*1
97
2 States
2
1 to 27
8
8
8
4
31 to 57
*1
8-Bit Bus
3 States
2
1 to 31
12
12
12
4
43 to 73
*1
External Memory
*4
*4
*4
*4
2 States
2
1 to 23
4
4
4
4
19 to 41
*1
16-Bit Bus
3 States
2
1 to 25
6
6
6
4
25 to 49
*1
*4
*4
*4
*4

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