HD6413003TF16 Renesas Electronics America, HD6413003TF16 Datasheet - Page 252

IC H8 MCU ROMLESS QFP112

HD6413003TF16

Manufacturer Part Number
HD6413003TF16
Description
IC H8 MCU ROMLESS QFP112
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD6413003TF16

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
DMA, PWM, WDT
Number Of I /o
50
Program Memory Type
ROMless
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
112-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-

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8.6 Usage Notes
8.6.1 Note on Word Data Transfer
Word data cannot be accessed starting at an odd address. When word-size transfer is selected, set
even values in the memory and I/O address registers (MAR and IOAR).
8.6.2 DMAC Self-Access
The DMAC itself cannot be accessed during a DMAC cycle. DMAC registers cannot be specified
as source or destination addresses.
8.6.3 Longword Access to Memory Address Registers
A memory address register can be accessed as longword data at the MARR address.
Example
MOV.L
MOV.L
Four byte accesses are performed. Note that the CPU may release the bus between the second byte
(MARE) and third byte (MARH).
Memory address registers should be written and read only when the DMAC is halted.
8.6.4 Note on Full Address Mode Setup
Full address mode is controlled by two registers: DTCRA and DTCRB. Care must be taken to
prevent the B channel from operating in short address mode during the register setup. The enable
bits (DTE and DTME) should not be set to 1 until the end of the setup procedure.
#LBL, ER0
ER0, @MARR
232

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