HD6413003TF16 Renesas Electronics America, HD6413003TF16 Datasheet - Page 425

IC H8 MCU ROMLESS QFP112

HD6413003TF16

Manufacturer Part Number
HD6413003TF16
Description
IC H8 MCU ROMLESS QFP112
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD6413003TF16

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
DMA, PWM, WDT
Number Of I /o
50
Program Memory Type
ROMless
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
112-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-

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11.4 Usage Notes
11.4.1 Operation of TPC Output Pins
TP
output is enabled, the corresponding pins cannot be used for TPC output. The data transfer from
NDR bits to DR bits takes place, however, regardless of the usage of the pin.
Pin functions should be changed only under conditions in which the output trigger event will not
occur.
11.4.2 Note on Non-Overlapping Output
During non-overlapping operation, the transfer of NDR bit values to DR bits takes place as
follows.
1. NDR bits are always transferred to DR bits at compare match A.
2. At compare match B, NDR bits are transferred only if their value is 0. Bits are not transferred
Figure 11-9 illustrates the non-overlapping TPC output operation.
0
TPC output pin
to TP
if their value is 1.
15
are multiplexed with ITU, DMAC, and other pin functions. When ITU or DMAC
DDR
Q
Figure 11-9 Non-Overlapping TPC Output
Q
NDER
Q
DR
C
405
D
Compare match A
Compare match B
Q
NDR
D
Internal
data bus

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