HD6413003TF16 Renesas Electronics America, HD6413003TF16 Datasheet - Page 418

IC H8 MCU ROMLESS QFP112

HD6413003TF16

Manufacturer Part Number
HD6413003TF16
Description
IC H8 MCU ROMLESS QFP112
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD6413003TF16

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
DMA, PWM, WDT
Number Of I /o
50
Program Memory Type
ROMless
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
112-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-

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11.3 Operation
11.3.1 Overview
When corresponding bits in PADDR or PBDDR and NDERA or NDERB are set to 1, TPC output
is enabled. The TPC output initially consists of the corresponding PADR or PBDR contents.
When a compare-match event selected in TPCR occurs, the corresponding NDRA or NDRB bit
contents are transferred to PADR or PBDR to update the output values.
Figure 11-2 illustrates the TPC output operation. Table 11-3 summarizes the TPC operating
conditions.
Table 11-3 TPC Operating Conditions
NDER
0
1
Sequential output of up to 16-bit patterns is possible by writing new output data to NDRA and
NDRB before the next compare match. For information on non-overlapping operation, see
section 11.3.4, Non-Overlapping TPC Output.
TPC output pin
DDR
0
1
0
1
DDR
Q
Pin Function
Generic input port
Generic output port
Generic input port (but the DR bit is a read-only bit, and when compare
match occurs, the NDR bit value is transferred to the DR bit)
TPC pulse output
Figure 11-2 TPC Output Operation
Q
NDER
Q
DR
C
Output trigger signal
398
D
Q
NDR
D
Internal
data bus

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