HD6413003TF16 Renesas Electronics America, HD6413003TF16 Datasheet - Page 577

IC H8 MCU ROMLESS QFP112

HD6413003TF16

Manufacturer Part Number
HD6413003TF16
Description
IC H8 MCU ROMLESS QFP112
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD6413003TF16

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
DMA, PWM, WDT
Number Of I /o
50
Program Memory Type
ROMless
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
112-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-

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Table A-1 Instruction Set (cont)
2. Arithmetic instructions
Mnemonic
PUSH.W Rn
PUSH.L ERn
MOVFPE @aa:16,
Rd
MOVTPE Rs,
@aa:16
Mnemonic
ADD.B #xx:8, Rd
ADD.B Rs, Rd
ADD.W #xx:16, Rd
ADD.W Rs, Rd
ADD.L #xx:32, ERd
ADD.L ERs, ERd
ADDX.B #xx:8, Rd
ADDX.B Rs, Rd
ADDS.L #1, ERd
ADDS.L #2, ERd
ADDS.L #4, ERd
INC.B Rd
INC.W #1, Rd
INC.W #2, Rd
W SP–2
W Rd16+#xx:16
W Rd16+Rs16
W Rd16+1
W Rd16+2
B
B
B
B
B
B
B
L
L
L
L
L
L
Operation
Rn16
SP–4
ERn32
Cannot be used in the
H8/3003
Cannot be used in the
H8/3003
Operation
Rd8+#xx:8
Rd8+Rs8
ERd32+#xx:32
ERd32
ERd32+ERs32
ERd32
Rd8+#xx:8 +C
Rd8+Rs8 +C
ERd32+1
ERd32+2
ERd32+4
Rd8+1
@SP
SP
SP
Rd8
@SP
Rd16
Rd16
Rd8
ERd32
ERd32
ERd32
Rd8
Rd16
Rd8
Rd16
Rd8
2
4
6
2
Instruction Length (bytes)
Instruction Length (bytes)
2
2
2
2
2
2
2
2
2
2
557
Addressing Mode and
Addressing Mode and
4
4
2 — —
4 — —
— 1
— 2
— 2
— — — — — —
— — — — — —
— — — — — —
— —
— —
— —
I
I
Cannot be used in the H8/3003
Cannot be used in the H8/3003
Condition Code
Condition Code
H N Z
H N Z
1
3
3
V C
0 —
0 —
V C
States
States
No. of
No. of
10
6
2
2
4
2
6
2
2
2
2
2
2
2
2
2
*1
*1

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