HD6413003TF16 Renesas Electronics America, HD6413003TF16 Datasheet - Page 152

IC H8 MCU ROMLESS QFP112

HD6413003TF16

Manufacturer Part Number
HD6413003TF16
Description
IC H8 MCU ROMLESS QFP112
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD6413003TF16

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
DMA, PWM, WDT
Number Of I /o
50
Program Memory Type
ROMless
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
112-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-

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6.4 Usage Notes
6.4.1 Connection to Dynamic RAM and Pseudo-Static RAM
A different bus control signal timing applies when dynamic RAM or pseudo-static RAM is
connected to area 3. For details see section 7, Refresh Controller.
6.4.2 Register Write Timing
ABWCR, ASTCR, and WCER Write Timing: Data written to ABWCR, ASTCR, or WCER
takes effect starting from the next bus cycle. Figure 6-20 shows the timing when an instruction
fetched from area 0 changes area 0 from three-state access to two-state access.
ø
Address
3-state access to area 0
T
1
T
2
Figure 6-20 ASTCR Write Timing
T
3
T
1
ASTCR address
132
T
2
T
3
2-state access
to area 0
T
1
T
2

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