HD6413003TF16 Renesas Electronics America, HD6413003TF16 Datasheet - Page 444

IC H8 MCU ROMLESS QFP112

HD6413003TF16

Manufacturer Part Number
HD6413003TF16
Description
IC H8 MCU ROMLESS QFP112
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD6413003TF16

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
DMA, PWM, WDT
Number Of I /o
50
Program Memory Type
ROMless
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
112-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6413003TF16
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
HD6413003TF16V
Manufacturer:
ITT
Quantity:
12 000
Part Number:
HD6413003TF16V
Manufacturer:
RENESAS
Quantity:
36
Part Number:
HD6413003TF16V
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Full duplex communication
The transmitting and receiving sections are independent, so the SCI can transmit and receive
simultaneously. The transmitting and receiving sections are both double-buffered, so serial
data can be transmitted and received continuously.
Built-in baud rate generator with selectable bit rates
Selectable transmit/receive clock sources: internal clock from baud rate generator, or external
clock from the SCK pin.
Four types of interrupts
Transmit-data-empty, transmit-end, receive-data-full, and receive-error interrupts are
requested independently. The transmit-data-empty and receive-data-full interrupts can activate
the DMA controller (DMAC) to transfer data.
424

Related parts for HD6413003TF16