HD6413003TF16 Renesas Electronics America, HD6413003TF16 Datasheet - Page 366

IC H8 MCU ROMLESS QFP112

HD6413003TF16

Manufacturer Part Number
HD6413003TF16
Description
IC H8 MCU ROMLESS QFP112
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD6413003TF16

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
DMA, PWM, WDT
Number Of I /o
50
Program Memory Type
ROMless
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
112-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6413003TF16
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
HD6413003TF16V
Manufacturer:
ITT
Quantity:
12 000
Part Number:
HD6413003TF16V
Manufacturer:
RENESAS
Quantity:
36
Part Number:
HD6413003TF16V
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
In complementary PWM mode, TCNT3 and TCNT4 overshoot and undershoot at the transitions
between up-counting and down-counting. The setting conditions for the IMFA bit in channel 3 and
the OVF bit in channel 4 differ from the usual conditions. In buffered operation the buffer transfer
conditions also differ. Timing diagrams are shown in figures 10-37 and 10-38.
Buffer transfer
signal (BR to GR)
TCNT3
GRA3
IMFA
GR
Figure 10-37 Overshoot Timing
N – 1
Buffer transfer
346
N
Set to 1
N
N + 1
N
Flag not set
No buffer transfer
N – 1

Related parts for HD6413003TF16