HD6413003TF16 Renesas Electronics America, HD6413003TF16 Datasheet - Page 147

IC H8 MCU ROMLESS QFP112

HD6413003TF16

Manufacturer Part Number
HD6413003TF16
Description
IC H8 MCU ROMLESS QFP112
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD6413003TF16

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
DMA, PWM, WDT
Number Of I /o
50
Program Memory Type
ROMless
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
112-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-

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6.3.6 Interconnections with Memory (Example)
For each area, the bus controller can select two- or three-state access and an 8- or 16-bit data bus
width. In three-state-access areas, wait states can be inserted in a variety of modes, simplifying the
connection of both high-speed and low-speed devices.
Figure 6-18 shows an example of interconnections between the H8/3003 and memory. Figure 6-17
shows a memory map for this example.
A 256-kword
16-bit bus.
Two 32-kword 8-bit SRAM devices (SRAM1 and SRAM2) are connected to area 1. These
devices are accessed in two states via a 16-bit bus.
One 32-kword 8-bit SRAM (SRAM3) is connected to area 7. This device is accessed via an
8-bit bus, using three-state access with an additional wait state inserted in pin auto-wait mode.
H'000000
H'03FFFF
H'1FFFFF
H'200000
H'20FFFF
H'210000
H'3FFFFF
H'E00000
H'E07FFF
H'FFFFFF
16-bit EPROM is connected to area 0. This device is accessed in three states via a
Figure 6-17 Memory Map (Example)
On-chip registers
On-chip RAM
SRAM 1, 2
Not used
Not used
Not used
SRAM 3
EPROM
127
Area 0
16-bit, three-state-access area
Area 1
16-bit, two-state-access area
Area 7
8-bit, three-state-access area
(one auto-wait state)

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