HD6413003TF16 Renesas Electronics America, HD6413003TF16 Datasheet - Page 593

IC H8 MCU ROMLESS QFP112

HD6413003TF16

Manufacturer Part Number
HD6413003TF16
Description
IC H8 MCU ROMLESS QFP112
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD6413003TF16

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
DMA, PWM, WDT
Number Of I /o
50
Program Memory Type
ROMless
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
112-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-

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Table A-3 Number of Cycles per Instruction
Instruction Mnemonic
ADD
ADDS
ADDX
AND
ANDC
BAND
Bcc
ADD.B #xx:8, Rd
ADD.B Rs, Rd
ADD.W #xx:16, Rd
ADD.W Rs, Rd
ADD.L #xx:32, ERd
ADD.L ERs, ERd
ADDS #1/2/4, ERd
ADDX #xx:8, Rd
ADDX Rs, Rd
AND.B #xx:8, Rd
AND.B Rs, Rd
AND.W #xx:16, Rd
AND.W Rs, Rd
AND.L #xx:32, ERd
AND.L ERs, ERd
ANDC #xx:8, CCR
BAND #xx:3, Rd
BAND #xx:3, @ERd
BAND #xx:3, @aa:8
BRA d:8 (BT d:8)
BRN d:8 (BF d:8)
BHI d:8
BLS d:8
BCC d:8 (BHS d:8)
BCS d:8 (BLO d:8)
BNE d:8
BEQ d:8
BVC d:8
BVS d:8
BPL d:8
BMI d:8
BGE d:8
BLT d:8
BGT d:8
BLE d:8
Instruction Branch
Fetch
I
1
1
2
1
3
1
1
1
1
1
1
2
1
3
2
1
1
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Addr. Read Operation Access
J
573
Stack
K
Byte Data Word Data Internal
L
1
1
Access
M
N
Operation

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