HD6413003TF16 Renesas Electronics America, HD6413003TF16 Datasheet - Page 475

IC H8 MCU ROMLESS QFP112

HD6413003TF16

Manufacturer Part Number
HD6413003TF16
Description
IC H8 MCU ROMLESS QFP112
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD6413003TF16

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
DMA, PWM, WDT
Number Of I /o
50
Program Memory Type
ROMless
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
112-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-

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Set TE or RE bit to 1 in SCR
Set CKE1 and CKE0 bits
Transmitting or receiving
Set RIE, TIE, TEIE, and
in SCR (leaving TE and
MPIE bits as necessary
Select communication
Clear TE and RE bits
RE bits cleared to 0)
Start of initialization
Set value in BRR
format in SMR
1 bit interval
to 0 in SCR
elapsed?
Yes
Figure 13-4 Sample Flowchart for SCI Initialization
Wait
No
1
2
3
4
1.
2.
3.
4.
Select the clock source in SCR. Clear the RIE, TIE, TEIE,
MPIE, TE, and RE bits to 0. If clock output is selected in
asynchronous mode, clock output starts immediately after
the setting is made in SCR.
Select the communication format in SMR.
Write the value corresponding to the bit rate in BRR.
This step is not necessary when an external clock is used.
Wait for at least the interval required to transmit or receive
1 bit, then set the TE or RE bit to 1 in SCR. Set the RIE,
TIE, TEIE, and MPIE bits as necessary. Setting the TE
or RE bit enables the SCI to use the TxD or RxD pin.
455

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