HD6413003TF16 Renesas Electronics America, HD6413003TF16 Datasheet - Page 148

IC H8 MCU ROMLESS QFP112

HD6413003TF16

Manufacturer Part Number
HD6413003TF16
Description
IC H8 MCU ROMLESS QFP112
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD6413003TF16

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
DMA, PWM, WDT
Number Of I /o
50
Program Memory Type
ROMless
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
112-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6413003TF16
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
HD6413003TF16V
Manufacturer:
ITT
Quantity:
12 000
Part Number:
HD6413003TF16V
Manufacturer:
RENESAS
Quantity:
36
Part Number:
HD6413003TF16V
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Figure 6-18 Interconnections between H8/3003 and Memory (Example)
H8/3003
D
A
D to D
15
23
7
WAIT
HWR
to D
to A
LWR
CS
CS
CS
RD
0
1
7
0
8
0
128
A
A
A
A
19
15
15
14
to A
to A
to A
to A
SRAM1 (even addresses)
SRAM2 (odd addresses)
1
1
1
0
A
I/O
I/O to I/O
CE
OE
A
I/O to I/O
CS
OE
WE
A
I/O to I/O
CS
OE
WE
A
I/O to I/O
CS
OE
WE
14
18
14
14
EPROM
15
7
7
7
7
SRAM3
to A
to A
to A
to A
to I/O
0
0
0
0
0
0
0
0
8

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