HD6413003TF16 Renesas Electronics America, HD6413003TF16 Datasheet - Page 571

IC H8 MCU ROMLESS QFP112

HD6413003TF16

Manufacturer Part Number
HD6413003TF16
Description
IC H8 MCU ROMLESS QFP112
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD6413003TF16

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
DMA, PWM, WDT
Number Of I /o
50
Program Memory Type
ROMless
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
112-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-

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18.3.8 DMAC Timing
DMAC timing is shown as follows.
ø
TEND
DMAC
Figure 18-25 shows the DMAC TEND output timing/2 state access
DMAC TEND output timing/3 state access
Figure 18-26 shows the DMAC TEND output timing/3 state access.
DMAC DREQ input timing
Figure 18-27 shows DMAC DREQ input timing.
TEND output timing/2 state access
ø
TEND
Figure 18-25 DMAC TEND Output Timing/2 State Access
Figure 18-26 DMAC TEND Output Timing/3 State Access
t
TED1
T
t
TED1
1
T
1
T
551
2
T
2
T
3
t
TED2
t
TED2

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