HD6413003TF16 Renesas Electronics America, HD6413003TF16 Datasheet - Page 236

IC H8 MCU ROMLESS QFP112

HD6413003TF16

Manufacturer Part Number
HD6413003TF16
Description
IC H8 MCU ROMLESS QFP112
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD6413003TF16

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
DMA, PWM, WDT
Number Of I /o
50
Program Memory Type
ROMless
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
112-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-

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8.4.8 DMAC Bus Cycle
Figure 8-13 shows an example of the timing of the basic DMAC bus cycle. This example shows a
word-size transfer from a 16-bit two-state access area to an 8-bit three-state access area. When the
DMAC gets the bus from the CPU, after one dead cycle (T
writes to the destination address. During these read and write operations the bus is not released
even if there is another bus request. DMAC cycles comply with bus controller settings in the same
way as CPU cycles.
Figure 8-14 shows the timing when the DMAC is activated by low input at a DREQ pin. This
example shows a word-size transfer from a 16-bit two-state access area to another 16-bit two-state
access area. The DMAC continues the transfer while the DREQ pin is held low.
ø
A
RD
HWR
LWR
23
to A
0
T
1
CPU cycle
T
2
Figure 8-13 DMA Transfer Bus Timing (Example)
T
1
T
2
T
d
T
Source
address
1
DMAC cycle (word transfer)
T
2
216
T
1
T
Destination address
2
T
d
3
), it reads from the source address and
T
1
T
2
T
3
T
1
T
CPU cycle
2
T
1
T
2

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