HD6413003TF16 Renesas Electronics America, HD6413003TF16 Datasheet - Page 240

IC H8 MCU ROMLESS QFP112

HD6413003TF16

Manufacturer Part Number
HD6413003TF16
Description
IC H8 MCU ROMLESS QFP112
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD6413003TF16

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
DMA, PWM, WDT
Number Of I /o
50
Program Memory Type
ROMless
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
112-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6413003TF16
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
HD6413003TF16V
Manufacturer:
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Part Number:
HD6413003TF16V
Manufacturer:
RENESAS
Quantity:
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Part Number:
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Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Figure 8-18 shows the timing when the DMAC is activated by the falling edge of DREQ in block
transfer mode.
ø
DREQ
A
RD
HWR
23
Figure 8-17 Timing of DMAC Activation by Low DREQ Level in Normal Mode
to A
,
LWR
0
T
2
T
CPU cycle
Minimum 4 states
1
T
2
T
1
T
2
T
d
T
220
1
DMAC cycle
T
2
T
1
Next sampling point
T
2
T
1
T
2
CPU cycle
T
1
T
2
T
1

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