HD6413003TF16 Renesas Electronics America, HD6413003TF16 Datasheet - Page 181

IC H8 MCU ROMLESS QFP112

HD6413003TF16

Manufacturer Part Number
HD6413003TF16
Description
IC H8 MCU ROMLESS QFP112
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD6413003TF16

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
DMA, PWM, WDT
Number Of I /o
50
Program Memory Type
ROMless
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
112-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-

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Refresh Cycle Priority Order: When there are simultaneous bus requests, the priority order is:
For details see section 6.3.7, Bus Arbiter Operation.
Wait State Insertion: When bit AST3 is set to 1 in ASTCR, the wait state controller (WSC) can
insert wait states into bus cycles and refresh cycles. For details see section 6.3.5, Wait Modes.
Self-Refresh Mode: Some pseudo-static RAM devices have a self-refresh function. After the
SRFMD bit is set to 1 in RFSHCR, when a transition to software standby mode occurs, the
H8/3003’s CS
self-refresh function can be used. On exit from software standby mode, the RFSH output goes
high.
Table 7-8 shows the pin states in software standby mode. Figure 7-16 shows the signal output
timing.
Table 7-8 Pin States in Software Standby Mode (2) (PSRAME = 1, DRAME = 0)
Signal
CS
RD
HWR
LWR
RFSF
3
(High)
3
External bus master > refresh controller > DMA controller > CPU
output goes high and its RFSH output goes low so that the pseudo-static RAM
SRFMD = 0
High
High-impedance
High-impedance
High-impedance
High
Software Standby Mode
161
SRFMD = 1 (self-refresh mode)
High
High-impedance
High-impedance
High-impedance
Low
(Low)

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