IC SPARTAN-3E FPGA 250K 144TQFP

XC3S250E-4TQG144C

Manufacturer Part NumberXC3S250E-4TQG144C
DescriptionIC SPARTAN-3E FPGA 250K 144TQFP
ManufacturerXilinx Inc
SeriesSpartan™-3E
XC3S250E-4TQG144C datasheet
 


Specifications of XC3S250E-4TQG144C

Number Of Logic Elements/cells5508Number Of Labs/clbs612
Total Ram Bits221184Number Of I /o108
Number Of Gates250000Voltage - Supply1.14 V ~ 1.26 V
Mounting TypeSurface MountOperating Temperature0°C ~ 85°C
Package / Case144-LQFPFor Use With813-1009 - MODULE USB-TO-FPGA TOOL W/MANUAL
Lead Free Status / RoHS StatusLead free / RoHS CompliantOther names122-1524
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R
DS312 (v3.8) August 26, 2009
Module 1:
Spartan-3E FPGA Family: Introduction
and Ordering Information
DS312-1 (v3.8) August 26, 2009
Introduction
Features
Architectural Overview
Package Marking
Ordering Information
Module 2:
Functional Description
DS312-2 (v3.8) August 26, 2009
Input/Output Blocks (IOBs)
-
Overview
-
SelectIO™ Signal Standards
Configurable Logic Block (CLB)
Block RAM
Dedicated Multipliers
Digital Clock Manager (DCM)
Clock Network
Configuration
Powering Spartan®-3E FPGAs
Production Stepping
© 2005–2009 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and other coun-
tries. All other trademarks are the property of their respective owners.
DS312 (v3.8) August 26, 2009
0
Spartan-3E FPGA Family:
Data Sheet
Product Specification
0
0
Module 3:
DC and Switching Characteristics
DS312-3 (v3.8) August 26, 2009
DC Electrical Characteristics
-
Absolute Maximum Ratings
-
Supply Voltage Specifications
-
Recommended Operating Conditions
-
DC Characteristics
Switching Characteristics
-
I/O Timing
-
SLICE Timing
-
DCM Timing
-
Block RAM Timing
-
Multiplier Timing
-
Configuration and JTAG Timing
Module 4:
Pinout Descriptions
DS312-4 (v3.8) August 26, 2009
Pin Descriptions
Package Overview
Pinout Tables
Footprint Diagrams
www.xilinx.com
1

XC3S250E-4TQG144C Summary of contents

  • Page 1

    R DS312 (v3.8) August 26, 2009 Module 1: Spartan-3E FPGA Family: Introduction and Ordering Information DS312-1 (v3.8) August 26, 2009 • Introduction • Features • Architectural Overview • Package Marking • Ordering Information Module 2: Functional Description DS312-2 (v3.8) August ...

  • Page 2

    Spartan-3E FPGA Family: Data Sheet 2 www.xilinx.com R DS312 (v3.8) August 26, 2009 Product Specification ...

  • Page 3

    ... LVCMOS, LVTTL, HSTL, and SSTL single-ended signal standards - 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling Table 1: Summary of Spartan-3E FPGA Attributes Equivalent System Logic Device Gates Cells Rows Columns XC3S100E 100K 2,160 22 XC3S250E 250K 5,508 34 XC3S500E 500K 10,476 46 XC3S1200E 1200K 19,512 60 XC3S1600E 1600K 33,192 76 Notes: 1 ...

  • Page 4

    Architectural Overview The Spartan-3E family architecture consists of five funda- mental programmable functional elements: • Configurable Logic Blocks (CLBs) contain flexible Look-Up Tables (LUTs) that implement logic plus storage elements used as flip-flops or latches. CLBs perform a wide variety ...

  • Page 5

    ... Table 2: Available User I/Os and Differential (Diff) I/O Pairs VQ100 CP132 Package VQG100 CPG132 Size (mm Device User Diff User XC3S100E (7) (2) (11 XC3S250E (7) (2) (7) ( XC3S500E (7) (2) (7) XC3S1200E - - - XC3S1600E - - - Notes: 1. All Spartan-3E devices provided in the same package are pin-compatible as further described in Module 4: 2. ...

  • Page 6

    ... Stepping 1 production Figure 4 shows silicon. R SPARTAN R TM XC3S250E Package PQ208AGQ0525 D1234567A 4C Pin P1 BGA Ball A1 R SPARTAN R TM XC3S250E Device Type FT256AGQ0525 Package D1234567A 4C Speed Grade Ball A1 3S250E F1234567-0525 Lot Code PHILIPPINES Package C5AGQ CP132 C6 = CPG132 Process Code Mask Revision Code Fabrication Code www ...

  • Page 7

    ... Both the standard –4 and faster –5 speed grades are available for the Commercial temperature range. However, only the –4 speed grade is available for the Indus- trial temperature range. See age combinations. XC3S250E -4 FT 256 C S1 (optional code to specify Stepping 1) Temperature Range Number of Pins ...

  • Page 8

    ... The following table shows the revision history for this document. Date Version 03/01/05 1.0 Initial Xilinx release. 03/21/05 1.1 Added XC3S250E in CP132 package to for CP132 package. Added package markings for QFP packages CP132/CPG132 packages 11/23/05 2.0 Added differential HSTL and SSTL I/O standards. Updated input-only pins. Added diagrams. ...

  • Page 9

    R DS312-2 (v3.8) August 26, 2009 Design Documentation Available The functionality of the Spartan®-3E FPGA family is now described and updated in the following documents. The topics covered in each guide are listed below. • UG331: Spartan-3 Generation FPGA User ...

  • Page 10

    Functional Description Introduction As described in Architectural Overview, the Spartan™-3E FPGA architecture consists of five fundamental functional elements: • Input/Output Blocks (IOBs) • Configurable Logic Block (CLB) and Slice Resources • Block RAM • Dedicated Multipliers • Digital Clock Managers ...

  • Page 11

    TCE T2 O1 OTCLK1 OCE O2 OTCLK2 I IQ1 D IDDRIN1 IDDRIN2 CE ICLK1 CK ICE IQ2 D CE ICLK2 CK SR REV Notes: 1. All IOB control and output path signals have an ...

  • Page 12

    Functional Description Input Delay Functions Each IOB has a programmable delay block that optionally delays the input signal. In Figure 6, the signal path has a coarse delay element that can be bypassed. The input sig- nal then feeds a ...

  • Page 13

    R Storage Element Functions There are three pairs of storage elements in each IOB, one pair for each of the three paths possible to configure each of these storage elements as an edge-triggered D-type flip-flop (FD ...

  • Page 14

    Functional Description Table 5: Storage Element Options (Continued) Option Switch SRHIGH/SRLOW Determines whether SR acts as a Set, which forces the storage element to a logic "1" (SRHIGH Reset, which forces a logic "0" (SRLOW) INIT1/INIT0 When Global ...

  • Page 15

    R Register Cascade Feature In the Spartan-3E family, one of the IOBs in a differential pair can cascade its input storage elements with those in the other IOB as part of a differential pair. This is intended to make DDR ...

  • Page 16

    Functional Description D D1 From Fabric D2 D OCLK1 OCLK2 OCLK1 OCLK2 d D1 d+2 d+4 D2 d+1 d+3 d+5 PAD d d+1 d+2 d+3 d+4 Figure 10: Output DDR Table 6: Single-Ended IOSTANDARD Bank Compatibility Single-Ended IOSTANDARD 1.2V LVTTL ...

  • Page 17

    R Table 6: Single-Ended IOSTANDARD Bank Compatibility (Continued) Single-Ended IOSTANDARD 1.2V SSTL18_I - SSTL2_I - Notes: 1. N/R - Not required for input operation. Table 7: Differential IOSTANDARD Bank Compatibility Differential IOSTANDARD 1.8V LVDS_25 Input RSDS_25 Input MINI_LVDS_25 Input LVPECL_25 ...

  • Page 18

    Functional Description V provides current to the outputs and additionally pow- CCO ers the On-Chip Differential Termination. V 2.5V when using the On-Chip Differential Termination. The V lines are not required for differential operation. REF To further understand how to ...

  • Page 19

    R Table 8: Programmable Output Drive Current Output Drive Current (mA IOSTANDARD LVCMOS25 LVCMOS18 LVCMOS15 LVCMOS12 - - High output current drive strength and FAST output slew rates generally result in fastest I/O performance. However, these same ...

  • Page 20

    Functional Description exception for differential inputs (IP_Lxxx_x). For the differ- ential Dedicated Inputs, the on-chip differential termination is not available. To replace the on-chip differential termina- tion, choose a differential pair that supports outputs (IO_Lxxx_x) or use an external 100Ω ...

  • Page 21

    ... Look-Up Tables (LUTs) to imple- ment logic and two dedicated storage elements that can be used as flip-flops or latches. The LUTs can be used as a Spartan-3E FPGA Table 9: Spartan-3E CLB Resources CLB CLB Device Rows Columns XC3S100E 22 16 XC3S250E 34 26 XC3S500E 46 34 XC3S1200E 60 46 XC3S1600E 76 58 Notes: 1. ...

  • Page 22

    Functional Description . Notes: 1. Options to invert signal polarity as well as other options that enable lines for various functions are not shown. 2. The index i can depending on the slice. The upper ...

  • Page 23

    R Switch Matrix SHIFTOUT Slice Location Designations The Xilinx development software designates the location of a slice according to its X and Y coordinates, starting in the bottom left corner, as shown in Figure lowed by a number identifies columns ...

  • Page 24

    Functional Description The SLICEM pair supports two additional functions: • Two 16x1 distributed RAM blocks, RAM16 • Two 16-bit shift registers, SRL16 Each of these elements is described in more detail in the fol- lowing sections. Logic Cells The combination ...

  • Page 25

    R Table 10: Slice Inputs and Outputs (Continued) Name Location CLK SLICEL/M Common SHIFTIN SLICEM Top SHIFTOUT SLICEM Bottom CIN SLICEL/M Bottom COUT SLICEL/M Top X SLICEL/M Bottom Y SLICEL/M Top XB SLICEL/M Bottom YB SLICEL/M Top XQ SLICEL/M Bottom ...

  • Page 26

    Functional Description ing LUTs or by using the wide function multiplexers that are described later. The output of the LUT can connect to the wide multiplexer logic, the carry and arithmetic logic, or directly to a CLB out- put or ...

  • Page 27

    R Figure 20: MUXes and Dedicated Feedback in Spartan-3E CLB Table 11: MUX Capabilities MUX Usage F5MUX F5MUX FiMUX F6MUX F7MUX F8MUX DS312-2 (v3.8) August 26, 2009 Product Specification FXINB F8 FXINA F5 FXINB F6 FXINA F5 FXINB FX F7 ...

  • Page 28

    Functional Description The wide multiplexers can be used by the automatic tools or instantiated in a design using a component such as the F5MUX. The symbol, signals, and function are described below. The description is similar for the F6MUX, F7MUX, ...

  • Page 29

    R G[4: F[4: Table 14: Carry Logic Functions Function CYINIT Initializes carry chain for a slice. Fixed selection of: • CIN carry input from the slice below • BX input CY0F Carry generation for bottom ...

  • Page 30

    Functional Description Table 14: Carry Logic Functions (Continued) Function CYMUXG Carry generation or propagation mux for top half of slice. Dynamic selection via CYSELF of: • CYMUXF carry propagation (CYSELG = 1) • CY0G carry generation (CYSELG = 0) CYSELF ...

  • Page 31

    R The MULT_AND is useful for small multipliers. Larger multi- pliers can be built using the dedicated 18x18 multiplier blocks (see Dedicated Multipliers). Storage Elements The storage element, which is programmable as either a D-type flip-flop or a level-sensitive transparent ...

  • Page 32

    Functional Description Initialization The CLB storage elements are initialized at power-up, dur- ing configuration, by the global GSR signal, and by the indi- vidual SR or REV inputs to the CLB. The storage elements can also be re-initialized using the ...

  • Page 33

    R D A[3:0] WE WCLK DPRA[3:0] RAM16X1D WE D WCLK DPRA0 DPRA1 DPRA2 DPRA3 DS312-2_42_021305 Figure 27: Dual-Port RAM Component Table 18: Dual-Port RAM Function Inputs WE (mode) WCLK D 0 (read (read) ...

  • Page 34

    Functional Description The INIT attribute can be used to preload the memory with data during FPGA configuration. The default initial contents for RAM is all zeros. If the WE is held Low, the element can be considered a ROM. The ...

  • Page 35

    ... The block RAMs are located together with the multipliers on the die in one or two columns depending on the size of the device. The XC3S100E has one column of block RAM. The Spartan-3E devices ranging from the XC3S250E to XC3S1600E have two columns of block RAM. shows the number of RAM blocks, the data storage capac- ity, and the number of columns for each device ...

  • Page 36

    Functional Description Table 22: Port Aspect Ratios DIP/DOP Total Data DI/DO Data Parity Bus Path Width Bus Width Width 1 (w bits) (w-p bits) (p bits Notes: 1. ...

  • Page 37

    R Parity 512x36 Figure 31: Data Organization and Bus-matching Operation with Different Port Widths on Port A and Port B DS312-2 (v3.8) August 26, 2009 Product Specification Data ...

  • Page 38

    Functional Description Block RAM Port Signal Definitions Representations of the RAMB16_S[w ]_S[w ] and the A B RAMB16_S[w] with their associated signals are shown in Figure 32a and Figure 32b, respectively. These signals are defined in Table 23. The control ...

  • Page 39

    R Table 23: Block RAM Port Signals Port A Port B Signal Signal Signal Description Name Name Address Bus ADDRA ADDRB Data Input Bus DIA DIB Parity Data DIPA DIPB Input(s) Data Output Bus DOA DOB Parity Data DOPA DOPB ...

  • Page 40

    Functional Description Block RAM Attribute Definitions A block RAM has a number of attributes that control its behavior as shown in Table 24. Table 24: Block RAM Attributes Function Initial Content for Data Memory, Loaded during Configuration Initial Content for ...

  • Page 41

    R Table 25: Block RAM Function Table (Continued) Input Signals GSR EN SSR WE CLK ↑ There are a number of different conditions under which data can be accessed at the DO outputs. Basic data access ...

  • Page 42

    Functional Description Data_in CLK WE DI ADDR DO 0000 EN DISABLED Figure 33: Waveforms of Block RAM Data Operations with WRITE_FIRST Selected Setting the WRITE_MODE attribute to a value of WRITE_FIRST, data is written to the addressed memory location on ...

  • Page 43

    R Data_in CLK WE DI ADDR DO 0000 EN DISABLED Figure 35: Waveforms of Block RAM Data Operations with NO_CHANGE Selected Setting the WRITE_MODE attribute to a value of NO_CHANGE, puts the DO outputs in a latched state when asserting ...

  • Page 44

    Functional Description Dedicated Multipliers For additional information, refer to the “Using Embedded Multipliers” chapter in UG331. The Spartan-3E devices provide dedicated multiplier blocks per device. The multipliers are located together with the block RAM in one or ...

  • Page 45

    R MULT18X18SIO A[17:0] B[17:0] CEA CEB CEP CLK RSTA RSTB RSTP BCIN[17:0] Figure 37: MULT18X18SIO Primitive CEB CLK RSTB BCIN[17:0] CEB B[17:0] CLK RSTB DS312-2 (v3.8) August 26, 2009 Product Specification Cascading Multipliers The MULT18X18SIO primitive has two additional ports ...

  • Page 46

    Functional Description The BCIN and BCOUT ports have associated dedicated routing that connects adjacent multipliers within the same column. Via the cascade connection, the BCOUT port of one multiplier block drives the BCIN port of the multiplier block directly above ...

  • Page 47

    R Table 27 defines each port of the MULT18X18SIO primitive. Table 27: MULT18X18SIO Embedded Multiplier Primitives Description Signal Name Direction A[17:0] Input B[17:0] Input BCIN[17:0] Input P[35:0] Output BCOUT[17:0] Output CEA Input RSTA Input CEB Input RSTB Input CEP Input ...

  • Page 48

    ... This section provides a fun- damental description of the DCM. The XC3S100E FPGA has two DCMs, one at the top and one at the bottom of the device. The XC3S250E and XC3S500E FPGAs each include four DCMs, two at the top and two at the bottom. The XC3S1200E and XC3S1600E ...

  • Page 49

    R CLKIN CLKFB RST Table 28: DLL Signals Signal Direction CLKIN Input CLKFB Input CLK0 Output CLK90 Output CLK180 Output CLK270 Output CLK2X Output CLK2X180 Output CLKDV Output Delay-Locked Loop (DLL) The most basic function of the DLL component is ...

  • Page 50

    Functional Description clock distribution network, the clock signal returns to the DLL via a feedback line called CLKFB. The control block inside the DLL measures the phase error between CLKFB and CLKIN. This phase error is a measure of the ...

  • Page 51

    ... E12 GCLK7 GCLK6 GCLK5 Top Right DCM XC3S100: DCM_X0Y1 XC3S250E, XC3S500E: DCM_X1Y1 XC3S1200E, XC3S1600E: DCM_X2Y3 E 41) A Bottom Right DCM XC3S100: DCM_X0Y0 XC3S250E, XC3S500E: DCM_X1Y0 XC3S1200E, XC3S1600E: DCM_X2Y0 GCLK0 GCLK1 GCLK2 Differential Pair Differential Pair Pin Number for Single-Ended Input P38 P39 ...

  • Page 52

    Functional Description Table 31: Direct Clock Input and Optional External Feedback to Left-Edge DCMs (XC3S1200E and XC3S1600E) Single-Ended Pin Number by Package Type Diff. Clock VQ100 CP132 TQ144 P14 N P10 F2 P15 P P11 F1 P16 ...

  • Page 53

    R Every FPGA input provides a possible DCM clock input, but the path is not temperature and voltage compensated like the GCLKs. Alternatively, clock signals within the FPGA optionally provide a DCM clock input via a Global Clock Multiplexer Buffer ...

  • Page 54

    Functional Description Accommodating Input Frequencies Beyond Spec- ified Maximums If the CLKIN input frequency exceeds the maximum permit- ted, divide it down to an acceptable value using the CLKIN_DIVIDE_BY_2 attribute. When this attribute is set to “TRUE”, the CLKIN frequency ...

  • Page 55

    R The CLKFX_DIVIDE is an integer ranging from 1 to 32, inclusive and forms the denominator in example, if CLKFX_MULTIPLY = 5 and CLKFX_DIVIDE = 3, the frequency of the output clock signal is 5/3 that of the input clock ...

  • Page 56

    Functional Description FIXED Phase Shift Mode The FIXED phase shift mode shifts the DCM outputs by a fixed amount (T ), controlled by the user-specified PS PHASE_SHIFT attribute. The PHASE_SHIFT value (shown Figure 44) must be an ...

  • Page 57

    R VARIABLE Phase Shift Mode In VARIABLE phase shift mode, the FPGA application dynamically adjusts the fine phase shift value using three Table 36: Signals for Variable Phase Mode Signal Direction (1) PSEN Input (1) PSCLK Input (1) PSINCDEC Input ...

  • Page 58

    Functional Description Status Logic The Status Logic indicates the present state of the DCM and a means to reset the DCM to its initial known state. The Status Logic signals are described in In general, the Reset (RST) input is ...

  • Page 59

    R Clocking Infrastructure For additional information, refer to the Using Global Clock Resources chapter in UG331. The Spartan-3E clocking infrastructure, shown in provides a series of low-capacitance, low-skew interconnect lines well-suited to carrying high-frequency signals through- out the FPGA. The ...

  • Page 60

    ... E 8 Right Spine D Note 4 • • DCM XC3S1200E (X3Y2) XC3S1600E (X3Y2) 2 • B Bottom Right 8 Quadrant (BR DCM XC3S100E (X0Y0) XC3S250E (X1Y0) XC3S500E (X1Y0) XC3S1200E (X2Y0) XC3S1600E (X2Y0) DS312-2_04_041106 41. Table 31, and Table 32. Direct pin inputs to a DCM DS312-2 (v3.8) August 26, 2009 Product Specification ...

  • Page 61

    R By contrast, the clock switch matrixes on the top and bottom edges receive signals from any of the five following sources: two GCLK pins, two DCM outputs, or one Double-Line inter- connect. Table 41 indicates permissible connections between clock ...

  • Page 62

    Functional Description CLK Switch LHCLK or RHCLK input Double Line DCM output* *(XC3S1200E and XC3S1600E only) Figure 46: Clock Switch Matrix to BUFGMUX Pair Connectivity Quadrant Clock Routing The clock routing within the FPGA is quadrant-based, as shown in Figure ...

  • Page 63

    R BUFGMUX Output X1Y10 (Global) X0Y9 (Left Half) X1Y11 (Global) X0Y8 (Left Half) X2Y10 (Global) X0Y7 (Left Half) X2Y11 (Global) X0Y6 (Left Half) X1Y0 (Global) X0Y5 (Left Half) X1Y1 (Global) X0Y4 (Left Half) X2Y0 (Global) X0Y3 (Left Half) X2Y1 (Global) ...

  • Page 64

    Functional Description Interconnect For additional information, refer to the Using Interconnect chapter in UG331. Interconnect is the programmable network of signal path- ways between the inputs and outputs of functional elements within the FPGA, such as IOBs, CLBs, DCMs, and ...

  • Page 65

    R Switch IOB Matrix Switch IOB Matrix Switch IOB Matrix Switch IOB Matrix Switch IOB Matrix Figure 49: Array of Interconnect Tiles in Spartan-3E FPGA Horizontal and Vertical Long Lines (horizontal channel shown as an example) CLB Horizontal and Vertical ...

  • Page 66

    Functional Description Direct Connections Figure 50: Interconnect Types between Two Adjacent Interconnect Tiles (Continued) The four types of general-purpose interconnect available in each channel, shown in Figure 50, are described below. Long Lines Each set of 24 long line signals ...

  • Page 67

    R Configuration For additional information on configuration, refer to UG332: Spartan-3 Generation Configuration User Guide. Differences from Spartan-3 FPGAs In general, Spartan-3E FPGA configuration modes are a superset to those available in Spartan-3 FPGAs. Two new modes added in Spartan-3E ...

  • Page 68

    ... Table 45: Number of Bits to Program a Spartan-3E FPGA (Uncompressed Bitstreams) Spartan-3E FPGA Configuration Bits XC3S100E XC3S250E XC3S500E XC3S1200E XC3S1600E Pin Behavior During Configuration For additional information, refer to the “Configuration Pins and Behavior during Configuration” chapter in UG332. ...

  • Page 69

    R Table 46: Pin Behavior during Configuration (Continued) Pin Name Master Serial D1 D0/DIN DIN RDWR_B A23 A22 A21 A20 A19/VS2 A18/VS1 A17/VS0 A16 A15 A14 A13 A12 A11 A10 ...

  • Page 70

    Functional Description JTAG boundary-scan pins: TDI, TDO, TMS, and TCK. All other configuration pins are dual-purpose I/O pins and are available to the FPGA application after the DONE pin goes High. See Start-Up for additional information. Table 47 shows the ...

  • Page 71

    R Table 49: Pull-up or Pull-down Values for HSWAP, M[2:0], and VS[2:0] I/O Pull-up Resistors HSWAP Value during Configuration 0 Enabled 1 Disabled The Configuration section provides detailed schematics for each configuration mode. The schematics indicate the required logic values ...

  • Page 72

    Functional Description Master Serial Mode For additional information, refer to the Master Serial Mode chapter in UG332. In Master Serial mode (M[2:0] = <0:0:0>), the Spartan-3E FPGA configures itself from an attached Xilinx Platform P HSWAP Serial Master Mode ‘0’ ...

  • Page 73

    R Table 50: Serial Master Mode Connections FPGA Pin Name Direction HSWAP Input User I/O Pull-Up Control. When Low during configuration, enables pull-up resistors in all P I/O pins to respective I/O bank V 0: Pull-ups during configuration 1: No ...

  • Page 74

    ... Table 51: Number of Bits to Program a Spartan-3E FPGA and Smallest Platform Flash PROM Number of Spartan-3E Configuration FPGA Bits XC3S100E 581,344 XC3S250E 1,353,728 XC3S500E 2,270,208 XC3S1200E 3,841,184 5,969,696 XC3S1600E 74 The XC3S1600E requires an 8 Mbit PROM. Two solutions are possible: either a single 8 Mbit XCF08P parallel/serial PROM or two 4 Mbit XCF04S serial PROMs cascaded ...

  • Page 75

    R +1.2V VCCINT P HSWAP VCCO_0 VCCO_2 DIN Serial Master Mode CCLK ‘0’ M2 DOUT ‘0’ M1 INIT_B ‘0’ M0 Spartan-3E FPGA +2.5V JTAG VCCAUX TDI TDI TDO TMS TMS TCK TCK TDO PROG_B DONE GND PROG_B Recommend open-drain driver ...

  • Page 76

    Functional Description SPI Mode Variant Select S +2.5V JTAG TDI TMS TCK TDO PROG_B Recommend open-drain driver Figure 53: SPI Flash PROM Interface for PROMs Supporting READ (0x03) and FAST_READ (0x0B) Commands S Although SPI is a standard four-wire interface, ...

  • Page 77

    R P HSWAP SPI Mode ‘0’ M2 ‘0’ M1 ‘1’ M0 Spartan-3E Variant Select ‘1’ VS2 ‘1’ VS1 ‘0’ VS0 +2.5V JTAG TDI TDI TMS TMS TCK TCK TDO PROG_B PROG_B Recommend open-drain driver Figure 54: Atmel SPI-based DataFlash Configuration ...

  • Page 78

    Functional Description Table 53: Variant Select Codes for Various SPI Serial Flash PROMs SPI Read VS2 VS1 VS0 Command FAST READ (0x0B (see Figure 53) READ (0x03 (see Figure 53) READ ARRAY (0xE8) 1 ...

  • Page 79

    R W Table 54 shows the connections between the SPI Flash PROM and the FPGA’s SPI configuration interface. Each SPI Flash PROM vendor uses slightly different signal nam- ing. The SPI Flash PROM’s write protect and hold controls Table 54: ...

  • Page 80

    Functional Description Table 55: Serial Peripheral Interface (SPI) Connections FPGA Pin Name Direction Input User I/O Pull-Up Control. When Low HSWAP during configuration, enables pull-up P resistors in all I/O pins to respective I/O bank V CCO 0: Pull-ups during ...

  • Page 81

    R Table 55: Serial Peripheral Interface (SPI) Connections (Continued) FPGA Pin Name Direction Open-drain FPGA Configuration Done. Low during DONE bidirectional configuration. Goes High when FPGA I/O successfully completes configuration. Requires external 330 Ω pull-up resistor to 2.5V. Input Program ...

  • Page 82

    ... Table 74 of Mod- FPGA and Smallest SPI Flash PROM Device XC3S100E , POR XC3S250E XC3S500E XC3S1200E XC3S1600E CCLK Frequency In SPI Flash mode, the FPGA’s internal oscillator generates the configuration clock frequency. The FPGA provides this clock on its CCLK output pin, driving the PROM’s clock input Figure 54 ...

  • Page 83

    R If not using the SPI Flash PROM after configuration, drive CSO_B High to disable the PROM. The MOSI, DIN, and CCLK pins are then available to the FPGA application. Because all the interface pins are user I/O after configura- ...

  • Page 84

    Functional Description Daisy-Chaining If the application requires multiple FPGAs with different con- figurations, then configure the FPGAs using a daisy chain, as shown in Figure 57. Daisy-chaining from a single SPI serial Flash PROM is supported in Stepping 1 devices. ...

  • Page 85

    ... Flash. Only 20 address lines are generated for Spartan-3E FPGAs in the TQ144 package. Similarly, the XC3S100E FPGA in the CP132 package only has 20 address lines while the XC3S250E and XC3S500E FPGAs in the same package have 24 address lines. When using the VQ100 package, the BPI mode is not available when using parallel NOR Flash, but is supported using parallel Platform Flash (XCFxxP) ...

  • Page 86

    Functional Description Not available in VQ100 package BPI Mode +2.5V JTAG TDI TMS TCK TDO PROG_B Recommend open-drain driver Figure 58: Byte-wide Peripheral Interface (BPI) Mode Configured from Parallel NOR Flash PROMs A During configuration, the value of the M0 ...

  • Page 87

    R This addressing flexibility allows the FPGA to share the par- allel Flash PROM with an external or embedded processor. Depending on the specific processor architecture, the pro- cessor boots either from the top or bottom of memory. The FPGA ...

  • Page 88

    Functional Description Table 59: Byte-Wide Peripheral Interface (BPI) Connections (Continued) Pin Name FPGA Direction LDC1 Output PROM Output Enable HDC Output PROM Write Enable LDC2 Output PROM Byte Mode D A[23:0] Output Address D[7:0] Input Data Input CSO_B Output Chip ...

  • Page 89

    R Table 59: Byte-Wide Peripheral Interface (BPI) Connections (Continued) Pin Name FPGA Direction CCLK Output Configuration Clock. Generated by FPGA internal oscillator. Frequency controlled by ConfigRate bitstream generator option. If CCLK PCB trace is long or has multiple connections, terminate ...

  • Page 90

    ... FPGA file sizes. An application can also use a larger-density Table 60: Number of Bits to Program a Spartan-3E FPGA and Smallest Parallel Flash PROM Uncompressed Spartan-3E FPGA File Sizes (bits) XC3S100E XC3S250E XC3S500E XC3S1200E XC3S1600E Compatible Flash Families The Spartan-3E BPI configuration interface operates with a wide variety x8/x16 parallel NOR Flash devices. ...

  • Page 91

    R desired, use a larger parallel Flash PROM to contain addi- tional non-volatile application data, such as MicroBlaze pro- cessor code, or other user data, such as serial numbers and Ethernet MAC IDs. In such an example, the FPGA config- ...

  • Page 92

    Functional Description Table 63: FPGA Connections to Flash PROM with IO15/A-1 Pin (Continued) Connection to Flash PROM with FPGA Pin IO15/A-1 Pin A[23:1] A[n:0] A0 IO15/A-1 D[7:0] IO[7:0] User I/O Upper data lines IO[14:8] not required unless used as x16 ...

  • Page 93

    R Stepping 0 Limitations when Reprogramming via JTAG if FPGA Set for BPI Configuration The FPGA can always be reprogrammed via the JTAG port, regardless of the mode pin (M[2:0]) settings. However, Stepping 0 devices have a minor limitation. If ...

  • Page 94

    Functional Description After the FPGA configures itself using BPI mode from one end of the parallel Flash PROM, then the FPGA can trigger a MultiBoot event and reconfigure itself from the opposite end of the parallel Flash PROM. MultiBoot is ...

  • Page 95

    R Intelligent Download Host VCC Configuration Memory Source READ/WRITE - Internal memory - Disk drive - Over network - Over RF link GND - Microcontroller - Processor - Tester - Computer PROG_B Recommend open-drain driver Slave Parallel Mode For additional ...

  • Page 96

    Functional Description can also be eliminated from the interface. However, RDWR_B must remain Low during configuration. After configuration, all of the interface pins except DONE and PROG_B are available as user I/Os. Alternatively, the bidirectional SelectMAP configuration interface is available ...

  • Page 97

    R Table 65: Slave Parallel Mode Connections (Continued) Pin Name FPGA Direction INIT_B Open-drain Initialization Indicator. Active Low. bidirectional I/O Goes Low at the start of configuration during the Initialization memory clearing process. Released at the end of memory clearing, ...

  • Page 98

    Functional Description Parallel V Intelligent Download Host VCC DATA[7:0] Configuration BUSY Memory Source SELECT READ/WRITE • Internal memory CLOCK • Disk drive • PROG_B Over network • DONE Over RF link INIT_B GND • Microcontroller • Processor • Tester PROG_B ...

  • Page 99

    R V Intelligent Download Host VCC Configuration CLOCK Memory Source SERIAL_OUT PROG_B • Internal memory DONE • Disk drive INIT_B • Over network • Over RF link GND • Microcontroller • Processor • Tester • Computer PROG_B Recommend open-drain driver ...

  • Page 100

    Functional Description Table 66: Slave Serial Mode Connections Pin Name FPGA Direction HSWAP Input User I/O Pull-Up Control. When Low during configuration, enables pull-up resistors in all I/O pins to respective I/O bank 0: Pull-up during configuration 1: No pull-ups ...

  • Page 101

    R Intelligent V Download Host VCC Configuration CLOCK Memory Source SERIAL_OUT PROG_B • Internal memory DONE • Disk drive • INIT_B Over network • Over RF link GND • Microcontroller • Processor • Tester • Computer PROG_B Recommend open-drain driver ...

  • Page 102

    ... See XAPP453: The 3.3V Configuration of Spartan-3 FPGAs for additional information. Table 67: Spartan-3E JTAG Device Identifiers 4-Bit Revision Code Spartan-3E FPGA Step 0 Step 1 XC3S100E 0x0 0x1 XC3S250E 0x0 0x1 0x0 XC3S500E 0x4 0x2 0x0 XC3S1200E 0x2 0x1 0x0 ...

  • Page 103

    R Maximum Bitstream Size for Daisy-Chains The maximum bitstream length supported by Spartan-3E FPGAs in serial daisy-chains is 4,294,967,264 bits (4 Gbits), roughly equivalent to a daisy-chain with 720 XC3S1600E FPGAs. This is a limit only for serial daisy-chains where ...

  • Page 104

    Functional Description Figure 66: Generalized Spartan-3E FPGA Configuration Logic Block Diagram 104 www.xilinx.com R DS312-2_57_102605 DS312-2 (v3.8) August 26, 2009 Product Specification ...

  • Page 105

    R DS312-2 (v3.8) August 26, 2009 Product Specification Set PROG_B Low Power-On after Power-On V >1V CCINT No and V > 2V CCAUX and V Bank 2 > 1V CCO Yes Yes Clear configuration PROG_B = Low memory No INIT_ ...

  • Page 106

    Functional Description Load JPROG instruction Figure 68: Boundary-Scan Configuration Flow Diagram 106 Set PROG_B Low Power-On after Power-On V >1V CCINT and V > CCAUX and V Bank 2 > 1V CCO Yes Clear Yes configuration PROG_B = ...

  • Page 107

    R Start-Up At the end of configuration, the FPGA automatically pulses the Global Set/Reset (GSR) signal, placing all flip-flops in a known state. After configuration completes, the FPGA switches over to the user application loaded into the FPGA. The sequence ...

  • Page 108

    ... Speed Grade Block RAM Readback All Spartan-3E Table 68. The Read- General Readback (registers, distributed RAM) XC3S1200E XC3S1600E www.xilinx.com Commercial - Yes FPGAs XC3S100E Yes Yes XC3S250E Yes Yes XC3S500E Yes Yes No Yes No Yes DS312-2 (v3.8) August 26, 2009 Product Specification R Industrial -4 Yes Yes Yes ...

  • Page 109

    R Bitstream Generator (BitGen) Options For additional information, refer to the “Configuration Bit- stream Generator (BitGen) Settings” chapter in UG332. Various Spartan-3E FPGA functions are controlled by spe- cific bits in the configuration bitstream image. These values Table 69: Spartan-3E ...

  • Page 110

    Functional Description Table 69: Spartan-3E FPGA Bitstream Generator (BitGen) Options (Continued) Pins/Function Values Option Name Affected (default) DonePin DONE pin Pullup Pullnone DriveDone DONE pin DonePipe DONE pin ProgPin PROG_B pin Pullup Pullnone TckPin JTAG TCK pin Pullup Pulldown Pullnone ...

  • Page 111

    R Table 69: Spartan-3E FPGA Bitstream Generator (BitGen) Options (Continued) Pins/Function Values Option Name Affected (default) CRC Configuration Enable Disable Persist SelectMAP interface pins, BPI mode, Slave mode, Configuration Powering Spartan-3E FPGAs For additional information, refer to the “Powering Spartan-3 ...

  • Page 112

    Functional Description Voltage Regulators Various power supply manufacturers offer complete power solutions for Xilinx FPGAs including some with integrated three-rail regulators specifically designed for Spartan-3 and Spartan-3E FPGAs. The Xilinx Power Corner vides links to vendor solution guides and Xilinx ...

  • Page 113

    ... MHz (200 MHz for XC3S1200E) Split ranges at 5 – 90 MHz and 220 – 307 MHz (single range 5 – 307 MHz for XC3S1200E) No, single FPGA only (1) No Yes: XC3S100E, XC3S250E, XC3S500E ( XC3S1200E, XC3S1600E Requires V before V CCINT CCAUX No Table 72: Spartan-3E Optional Stepping Ordering ...

  • Page 114

    Functional Description Software Version Requirements Production Spartan-3E applications must be processed using the Xilinx ISE 8.1i, Service Pack 3 or later develop- ment software, using the v1.21 or later speed files. The ISE 8.1i software implements critical bitstream generator updates. ...

  • Page 115

    ... Date Version 03/01/05 1.0 Initial Xilinx release. 03/21/05 1.1 Updated 11/23/05 2.0 Updated values of configuration bitstream sizes for XC3S250E through XC3S1600E in Table Added Configuration. Added Stepping 0 limitations when mode. Added Managers (DCMs) enhanced the clock infrastructure diagram in Considerations VS[2:0] Pins in Table 53 ‘ ...

  • Page 116

    Functional Description Date Version 05/30/06 3.2.1 Corrected various typos and incorrect links. 10/02/06 3.3 Clarified that the block RAM the Industrial temperature range. 11/09/06 3.4 Updated the description of the Alignment is no longer supported. Updated input voltage tolerance. Replaced ...

  • Page 117

    R DS312-3 (v3.8) August 26, 2009 DC Electrical Characteristics In this section, specifications may be designated as Advance, Preliminary, or Production. These terms are defined as follows: Advance: Initial estimates are based on simulation, early characterization, and/or extrapolation from the ...

  • Page 118

    DC and Switching Characteristics Power Supply Specifications Table 74: Supply Voltage Thresholds for Power-On Reset Symbol V Threshold for the V CCINTT V Threshold for the V CCAUXT V Threshold for the V CCO2T Notes ...

  • Page 119

    R General Recommended Operating Conditions Table 77: General Recommended Operating Conditions Symbol T Junction temperature J V Internal supply voltage CCINT (1) V Output driver supply voltage CCO V Auxiliary supply voltage CCAUX (2,3,4,5) V Input voltage extremes to avoid ...

  • Page 120

    DC and Switching Characteristics General DC Characteristics for I/O Pins Table 78: General DC Characteristics of User I/O, Dual-Purpose, and Dedicated Pins Symbol Description I Leakage current at User I/O, L Input-only, Dual-Purpose, and Dedicated pins (2) I Current through ...

  • Page 121

    ... XC3S250E 15 XC3S500E 25 XC3S1200E 50 XC3S1600E 65 XC3S100E 0.8 XC3S250E 0.8 XC3S500E 0.8 XC3S1200E 1.5 XC3S1600E 1.5 XC3S100E 8 XC3S250E 12 XC3S500E 18 XC3S1200E 35 XC3S1600E 45 Table 77. of 25° 2.625V. The FPGA is programmed with a “blank” configuration data file (i.e., a CCAUX www.xilinx.com DC and Switching Characteristics Commercial Industrial (2) (2) ...

  • Page 122

    DC and Switching Characteristics Single-Ended I/O Standards Table 80: Recommended Operating Conditions for User I/Os Using Single-Ended Standards V for Drivers CCO IOSTANDARD Attribute Min (V) Nom (V) LVTTL 3.0 (4) LVCMOS33 3.0 (4,5) LVCMOS25 2.3 LVCMOS18 1.65 LVCMOS15 1.4 ...

  • Page 123

    R Table 81: DC Characteristics of User I/Os Using Single-Ended Standards Test Conditions IOSTANDARD Attribute (mA) (mA) (3) LVTTL 2 2 – – – – – ...

  • Page 124

    DC and Switching Characteristics Differential I/O Standards Internal Logic V V GND level Table 82: Recommended Operating Conditions for User I/Os Using Differential Signal Standards V CCO IOSTANDARD Attribute Min (V) LVDS_25 2.375 BLVDS_25 2.375 MINI_LVDS_25 2.375 (2) LVPECL_25 RSDS_25 ...

  • Page 125

    R Internal Logic V OUTN V OUTP GND level Table 83: DC Characteristics of User I/Os Using Differential Signal Standards V OD IOSTANDARD Min Typ Attribute (mV) (mV) LVDS_25 250 350 BLVDS_25 250 350 MINI_LVDS_25 300 – RSDS_25 100 – ...

  • Page 126

    ... Xilinx static timing ana- lyzer (TRACE in the Xilinx development software) and back-annotated to the simulation netlist. Table 84: Spartan-3E v1.27 Speed Grade Designations Device Advance XC3S100E XC3S250E XC3S500E XC3S1200E XC3S1600E Table 85 provides the history of the Spartan-3E speed files since all devices reached Production status. ...

  • Page 127

    ... XC3S250E Fast slew rate, (3) with DCM XC3S500E XC3S1200E XC3S1600E (2) LVCMOS25 , XC3S100E 12 mA output drive, XC3S250E Fast slew rate, without DCM XC3S500E XC3S1200E XC3S1600E Table 95 and are based on the operating conditions set forth in Table www.xilinx.com Speed Grade -5 -4 Max ...

  • Page 128

    ... XC3S1600E (3) LVCMOS25 , 0 XC3S100E IFD_DELAY_VALUE = 0, XC3S250E (4) with DCM XC3S500E XC3S1200E XC3S1600E (3) LVCMOS25 , 2 XC3S100E IFD_DELAY_VALUE = 3 XC3S250E default software setting 3 XC3S500E 3 XC3S1200E 3 XC3S1600E Table 95 and are based on the operating conditions set forth in Table Table www.xilinx.com Speed Grade -5 -4 Device Min Min 2.65 2.98 2.25 2 ...

  • Page 129

    R Table 88: Setup and Hold Times for the IOB Input Path Symbol Description Setup Times T Time from the setup of data at the IOPICK Input pin to the active transition at the ICLK input of the Input Flip-Flop ...

  • Page 130

    DC and Switching Characteristics Table 90: Propagation Times for the IOB Input Path Symbol Description Propagation Times T The time it takes for data to IOPLI travel from the Input pin through the IFF latch to the I output with ...

  • Page 131

    R Table 92: Timing for the IOB Output Path Symbol Description Clock-to-Output Times T When reading from the Output Flip-Flop IOCKP (OFF), the time from the active transition at the OCLK input to data appearing at the Output pin Propagation ...

  • Page 132

    DC and Switching Characteristics Table 93: Timing for the IOB Three-State Path Symbol Description Synchronous Output Enable/Disable Times T Time from the active transition at the OTCLK IOCKHZ input of the Three-state Flip-Flop (TFF) to when the Output pin enters ...

  • Page 133

    R Table 94: Output Timing Adjustments for IOB Convert Output Time from LVCMOS25 with 12mA Drive and Fast Slew Rate to the Following Signal Standard (IOSTANDARD) Single-Ended Standards LVTTL Slow ...

  • Page 134

    DC and Switching Characteristics Timing Measurement Methodology When measuring timing parameters at the programmable I/Os, different signal standards call for different test condi- tions. Table 95 lists the conditions to use for each standard. The method for measuring Input timing ...

  • Page 135

    R Table 95: Test Methods for Timing Measurement at I/Os (Continued) Signal Standard (IOSTANDARD) V REF DIFF_SSTL18_I - DIFF_SSTL2_I - Notes: 1. Descriptions of the relevant symbols are as follows: V – The reference voltage for setting the input switching ...

  • Page 136

    ... For each device/package combination, vides the number of equivalent V Table 96: Equivalent V /GND Pairs per Bank CCO Device VQ100 CP132 XC3S100E 2 XC3S250E 2 XC3S500E 2 XC3S1200E - XC3S1600E - 136 equivalent number of pairs is based on characterization and might not match the physical number of pairs. For each out- ...

  • Page 137

    R Table 97: Recommended Number of Simultaneously Switching Outputs per V -GND Pair CCO Package Type Signal Standard VQ TQ (IOSTANDARD) 100 144 Single-Ended Standards LVTTL Slow ...

  • Page 138

    DC and Switching Characteristics Configurable Logic Block (CLB) Timing Table 98: CLB (SLICEM) Timing Symbol Clock-to-Output Times T When reading from the FFX (FFY) Flip-Flop, CKO the time from the active transition at the CLK input to data appearing at ...

  • Page 139

    R Table 99: CLB Distributed RAM Switching Characteristics Symbol Clock-to-Output Times T Time from the active edge at the CLK input to data SHCKO appearing on the distributed RAM output Setup Times T Setup time of data at the BX ...

  • Page 140

    DC and Switching Characteristics Clock Buffer/Multiplexer Switching Characteristics Table 101: Clock Distribution Switching Characteristics Description Global clock buffer (BUFG, BUFGMUX, BUFGCE) I input to O-output delay Global clock multiplexer (BUFGMUX) select S-input setup to I0 and I1 inputs. Same as ...

  • Page 141

    Embedded Multiplier Timing Table 102 Embedded Multiplier Timing Symbol Combinatorial Delay T Combinatorial multiplier propagation delay from the A and B MULT inputs to the P outputs, assuming 18-bit inputs and a 36-bit ...

  • Page 142

    DC and Switching Characteristics Block RAM Timing Table 103: Block RAM Timing Symbol Clock-to-Output Times T When reading from block RAM, the delay from the BCKO active transition at the CLK input to data appearing at the DOUT output Setup ...

  • Page 143

    ... The DLL will track the fre- quency changes created by the spread spectrum clock to drive the global clocks to the FPGA logic. See XAPP469, Spread-Spectrum Clocking Reception for Displays for details. Description Stepping 0 XC3S100E XC3S250E XC3S500E XC3S1600E (3) XC3S1200E Stepping 1 All F < ...

  • Page 144

    ... XC3S1600E XC3S1200E Stepping 1 All Stepping 0 XC3S100E XC3S250E XC3S500E XC3S1600E XC3S1200E Stepping 1 All Stepping 0 XC3S100E XC3S250E XC3S500E XC3S1600E XC3S1200E Stepping 1 All Stepping 0 XC3S100E XC3S250E XC3S500E XC3S1600E XC3S1200E Stepping 1 All All All www.xilinx.com Speed Grade -5 -4 Min Max Min Max Units N/A N MHz ...

  • Page 145

    R Table 105: Switching Characteristics for the DLL (Continued) Symbol (4) Phase Alignment CLKIN_CLKFB_PHASE Phase offset between the CLKIN and CLKFB inputs CLKOUT_PHASE_DLL Phase offset between DLL outputs Lock Time (3) LOCK_DLL When using the DLL alone: The time from ...

  • Page 146

    ... Phase offset between the DFS CLKFX180 output and the DLL CLK0 output when both the DFS and DLL are used 146 Description F < 150 MHz CLKFX F > 150 MHz CLKFX Description Stepping 0 XC3S100E XC3S250E XC3S500E XC3S1600E Stepping 0 XC3S1200E Stepping 1 CLKIN ≤ 20 MHz CLKIN > 20 MHz www.xilinx.com Speed Grade ...

  • Page 147

    R Table 107: Switching Characteristics for the DFS (Continued) Symbol Lock Time (2) LOCK_FX The time from deassertion at the DCM’s Reset input to the rising transition at its LOCKED output. The DFS asserts LOCKED when the CLKFX and CLKFX180 ...

  • Page 148

    DC and Switching Characteristics Table 109: Switching Characteristics for the PS in Variable Phase Mode (Continued) Symbol Notes: 1. The numbers in this table are based on the operating conditions set forth in 2. The maximum variable phase shift range, ...

  • Page 149

    R Miscellaneous DCM Timing Table 110: Miscellaneous DCM Timing Symbol (1) DCM_RST_PW_MIN Minimum duration of a RST pulse width (2) DCM_RST_PW_MAX Maximum duration of a RST pulse width (3) DCM_CONFIG_LAG_TIME Maximum duration from V configuration successfully completed (DONE pin goes ...

  • Page 150

    ... DS312-3_01_103105 All Speed Grades Device Min Max XC3S100E - 5 XC3S250E - 5 XC3S500E - 5 XC3S1200E - 5 XC3S1600E - 7 All 0.5 - XC3S100E - 0.5 XC3S250E - 0.5 XC3S500E - 1 XC3S1200E - 2 XC3S1600E - 2 All 250 - All 0.5 4.0 77. This means power must be applied to all V DS312-3 (v3.8) August 26, 2009 Product Specification R 1.2V 2.5V Units ms ...

  • Page 151

    R Configuration Clock (CCLK) Characteristics Table 112: Master Mode CCLK Output Period by ConfigRate Option Setting Symbol Description CCLK clock period by T ConfigRate setting CCLK1 T CCLK3 T CCLK6 T CCLK12 T CCLK25 T CCLK50 Notes: 1. Set the ...

  • Page 152

    DC and Switching Characteristics Table 115: Slave Mode CCLK Input Low and High Time Symbol T CCLK Low and High time SCCL, T SCCH 152 Description www.xilinx.com R Min Max Units ∞ DS312-3 (v3.8) August 26, 2009 Product ...

  • Page 153

    R Master Serial and Slave Serial Mode Timing PROG_B (Input) INIT_B (Open-Drain) CCLK (Input/Output) DIN (Input) DOUT (Output) Figure 75: Waveforms for Master Serial and Slave Serial Configuration Table 116: Timing for the Master Serial and Slave Serial Configuration Modes ...

  • Page 154

    DC and Switching Characteristics Slave Parallel Mode Timing PROG_B (Input) INIT_B (Open-Drain) CSI_B (Input) RDWR_B (Input) CCLK (Input (Inputs) High-Z BUSY (Output) Notes possible to abort configuration by pulling CSI_B Low in a given ...

  • Page 155

    R Table 117: Timing for the Slave Parallel Configuration Mode (Continued) Symbol Hold Times T The time from the active edge of the CCLK pin to the point when data is last SMCCD held at the D0-D7 pins T The ...

  • Page 156

    DC and Switching Characteristics Serial Peripheral Interface (SPI) Configuration Timing PROG_B (Input) HSWAP HSWAP must be stable before INIT_B goes High and constant throughout the configuration process. (Input) VS[2:0] <1:1:1> (Input) M[2:0] <0:0:1> (Input) T MINIT INIT_B (Open-Drain) CCLK DIN ...

  • Page 157

    R Table 119: Configuration Timing Requirements for Attached SPI Serial Flash Symbol T SPI serial Flash PROM chip-select time CCS T SPI serial Flash PROM data input setup time DSU T SPI serial Flash PROM data input hold time DH ...

  • Page 158

    DC and Switching Characteristics Byte Peripheral Interface (BPI) Configuration Timing PROG_B (Input) HSWAP HSWAP must be stable before INIT_B goes High and constant throughout the configuration process. (Input) M[2:0] <0:1:0> (Input) T MINIT INIT_B (Open-Drain) LDC[2:0] HDC CSO_B CCLK A[23:0] ...

  • Page 159

    R Table 121: Configuration Timing Requirements for Attached Parallel NOR Flash Symbol Description T Parallel NOR Flash PROM chip-select time ELQV T Parallel NOR Flash PROM output-enable time GLQV T Parallel NOR Flash PROM ...

  • Page 160

    DC and Switching Characteristics IEEE 1149.1/1553 JTAG Test Access Port Timing TCK (Input) TMS (Input) TDI (Input) TDO (Output) Table 123: Timing for the JTAG Test Access Port Symbol Clock-to-Output Times T The time from the falling transition on the ...

  • Page 161

    R Revision History The following table shows the revision history for this document. Date Version 03/01/05 1.0 Initial Xilinx release. 11/23/05 2.0 Added AC timing information and additional DC specifications. 03/22/06 3.0 Upgraded data sheet status to Preliminary. Finalized production ...

  • Page 162

    DC and Switching Characteristics Date Version 04/18/08 3.7 Clarified that Stepping 0 was offered only for -4C and removed Stepping 0 -5 specifications. Added reference to XAPP459 in to 3.465V (3.3V + 5%) in Updated Recommended Operating Conditions for LVCMOS ...

  • Page 163

    R DS312-4 (v3.8) August 26, 2009 Introduction This section describes the various pins on a Spartan®-3E FPGA and how they connect within the supported compo- nent packages. Table 124: Types of Pins on Spartan-3E FPGAs Type / Color Code I/O ...

  • Page 164

    Pinout Descriptions Table 124: Types of Pins on Spartan-3E FPGAs (Continued) Type / Color Code CONFIG Dedicated configuration pin. Not available as a user-I/O pin. Every package has two dedicated configuration pins. These pins are powered by VCCAUX. See the ...

  • Page 165

    R Package Overview Table 125 shows the eight low-cost, space-saving produc- tion package styles for the Spartan-3E family. Each pack- age style is available as a standard and an environmentally friendly lead-free (Pb-free) option. The Pb-free packages include an extra ...

  • Page 166

    Pinout Descriptions Mechanical Drawings Detailed mechanical drawings for each package type are available from the Xilinx® web site at the specified location in Table 127. Table 127: Xilinx Package Mechanical Drawings and Material Declaration Data Sheets Package VQ100 VQG100 CP132 ...

  • Page 167

    ... XC3S100E 66 XC3S250E VQ100 66 XC3S500E 66 XC3S100E 83 XC3S250E CP132 92 XC3S500E 92 XC3S100E 108 TQ144 XC3S250E 108 XC3S250E 158 PQ208 XC3S500E 158 XC3S250E 172 XC3S500E FT256 190 XC3S1200E 190 XC3S500E 232 XC3S1200E FG320 250 XC3S1600E 250 XC3S1200E 304 FG400 XC3S1600E 304 XC3S1600E FG484 376 Notes: 1. ...

  • Page 168

    ... XC3S100E XC3S250E XC3S500E CP132 XC3S100E XC3S250E XC3S500E TQ144 XC3S100E XC3S250E PQ208 XC3S250E XC3S500E FT256 XC3S250E XC3S500E XC3S1200E FG320 XC3S500E XC3S1200E XC3S1600E FG400 XC3S1200E XC3S1600E FG484 XC3S1600E 168 age body (case) and the die junction temperature per watt of power consumption. The junction-to-board (θ ...

  • Page 169

    ... R VQ100: 100-lead Very-thin Quad Flat Package The XC3S100E, XC3S250E, and the XC3S500E devices are available in the 100-lead very-thin quad flat package, VQ100. All devices share a common footprint for this pack- age as shown in Table 131 and Figure Table 131 lists all the package pins. They are sorted by bank number and then by pin name ...

  • Page 170

    ... CONFIG P1 CONFIG P77 JTAG P100 JTAG P76 JTAG P75 JTAG P21 VCCAUX P46 VCCAUX P74 VCCAUX P96 VCCAUX P6 VCCINT P28 VCCINT www.xilinx.com XC3S100E XC3S250E VQ100 XC3S500E Pin Pin Name Number Type P56 VCCINT P80 VCCINT DS312-4 (v3.8) August 26, 2009 Product Specification R ...

  • Page 171

    ... User I/Os by Bank Table 132 indicates how the 66 available user-I/O pins are distributed between the four I/O banks on the VQ100 pack- age. Table 132: User I/Os Per Bank for XC3S100E, XC3S250E, and XC3S500E in the VQ100 Package Package Maximum Edge I/O Bank ...

  • Page 172

    Pinout Descriptions VQ100 Footprint In Figure 81, note pin 1 indicator in top-left corner and logo orientation. PROG_B 1 IO_L01P_3 2 IO_L01N_3 3 IO_L02P_3 4 IO_L02N_3/VREF_3 5 VCCINT 6 GND 7 VCCO_3 8 IO_L03P_3/LHCLK0 9 IO_L03N_3/LHCLK1 10 IO_L04P_3/LHCLK2 11 IO_L04N_3/LHCLK3 ...

  • Page 173

    ... I/O pair appear together in the table. The table also shows the pin number for each pin and the pin type, as defined earlier. Physically, the D14 and K2 balls on the XC3S100E and XC3S250E FPGAs are not connected but should be con- Pinout Table Table 133: CP132 Package Pinout XC3S100E ...

  • Page 174

    ... VCCO_1 2 IO/D5 2 IO/M1 2 IP/VREF_2 2 IO_L01N_2/INIT_B 2 IO_L01P_2/CSO_B 2 IO_L02N_2/MOSI/CSI_B 2 IO_L02P_2/DOUT/BUSY 2 IO_L03N_2/D6/GCLK13 2 IO_L03P_2/D7/GCLK12 2 IO_L04N_2/D3/GCLK15 2 IO_L04P_2/D4/GCLK14 2 IO_L06N_2/D1/GCLK3 174 XC3S250E XC3S500E Pin Name VCCO_0 VCCO_0 IO/A0 IO/VREF_1 IO_L01N_1/A15 IO_L01P_1/A16 IO_L02N_1/A13 IO_L02P_1/A14 IO_L03N_1/A11 IO_L03P_1/A12 IO_L04N_1/A9/RHCLK1 IO_L04P_1/A10/RHCLK0 IO_L05N_1/A7/RHCLK3/TRDY1 IO_L05P_1/A8/RHCLK2 IO_L06N_1/A5/RHCLK5 IO_L06P_1/A6/RHCLK4/IRDY1 IO_L07N_1/A3/RHCLK7 IO_L07P_1/A4/RHCLK6 IO_L08N_1/A1 IO_L08P_1/A2 IO_L09N_1/LDC0 IO_L09P_1/HDC IO_L10N_1/LDC2 ...

  • Page 175

    ... IO_L04N_3/LHCLK1 3 IO_L04P_3/LHCLK0 3 IO_L05N_3/LHCLK3/IRDY2 3 IO_L05P_3/LHCLK2 3 IO_L06N_3/LHCLK5 3 IO_L06P_3/LHCLK4/TRDY2 3 IO_L07N_3/LHCLK7 3 IO_L07P_3/LHCLK6 3 IO_L08N_3 3 IO_L08P_3 3 IO_L09N_3 DS312-4 (v3.8) August 26, 2009 Product Specification XC3S250E XC3S500E Pin Name IO_L06P_2/D2/GCLK2 IO_L07N_2/DIN/D0 IO_L07P_2/M0 IO_L08N_2/A22 IO_L08P_2/A23 IO_L09N_2/A20 IO_L09P_2/A21 IO_L10N_2/VS1/A18 IO_L10P_2/VS2/A19 IO_L11N_2/CCLK IO_L11P_2/VS0/A17 IP/VREF_2 IP_L05N_2/M2/GCLK1 IP_L05P_2/RDWR_B/GCLK0 VCCO_2 VCCO_2 IO IO/VREF_3 IO_L01N_3 IO_L01P_3 IO_L02N_3 ...

  • Page 176

    ... VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT VCCINT N.C. (VCCINT) VCCINT N.C. (VCCINT) VCCINT VCCINT VCCINT VCCINT 176 XC3S250E XC3S500E Pin Name IO_L09P_3 IP/VREF_3 VCCO_3 VCCO_3 GND GND GND GND GND GND GND GND GND GND GND GND ...

  • Page 177

    ... Some VREF and CLK pins are on INPUT pins. 2. The eight global clock pins in this bank have optional functionality during configuration and are counted in the DUAL column. Table 135: User I/Os Per Bank for the XC3S250E and XC3S500E in the CP132 Package Package Maximum ...

  • Page 178

    ... Spartan-3E devices available in the CP132 pack- age. The XC3S100E is duplicated on both the left and right sides of the table to show migrations to and from the XC3S250E and the XC3S500E. The arrows indicate the direction for easy migration. A double-ended arrow ( Table 136: CP132 Footprint Migration Differences ...

  • Page 179

    R CP132 Footprint I/O A PROG_B TDI GND L11P_0 I/O I/O I/O I/O B L11N_0 L10P_0 L01N_3 L01P_3 HSWAP I/O I/O I/O C GND L10N_0 L02N_3 L02P_3 I/O I/O D VCCINT L03N_3 L03P_3 INPUT E VCCO_3 GND ...

  • Page 180

    ... Pinout Descriptions TQ144: 144-lead Thin Quad Flat Package The XC3S100E and the XC3S250E FPGAs are available in the 144-lead thin quad flat package, TQ144. Both devices share a common footprint for this package as shown in Table 137 and Figure 83. Table 137 lists all the package pins. They are sorted by bank number and then by pin name of the largest device ...

  • Page 181

    ... IP/VREF_2 2 IO_L01N_2/INIT_B 2 IO_L01P_2/CSO_B 2 IO_L02N_2/MOSI/CSI_B 2 IO_L02P_2/DOUT/BUSY 2 IO_L04N_2/D6/GCLK13 2 IO_L04P_2/D7/GCLK12 2 IO_L05N_2/D3/GCLK15 2 IO_L05P_2/D4/GCLK14 2 IO_L07N_2/D1/GCLK3 2 IO_L07P_2/D2/GCLK2 2 IO_L08N_2/DIN/D0 DS312-4 (v3.8) August 26, 2009 Product Specification XC3S250E Pin Name IO_L01P_1/A16 IO_L02N_1/A13 IO_L02P_1/A14 IO_L03N_1/A11 IO_L03P_1/A12 IO_L04N_1/A9/RHCLK1 IO_L04P_1/A10/RHCLK0 IO_L05N_1/A7/RHCLK3 IO_L05P_1/A8/RHCLK2 IO_L06N_1/A5/RHCLK5 IO_L06P_1/A6/RHCLK4 IO_L07N_1/A3/RHCLK7 IO_L07P_1/A4/RHCLK6 IO_L08N_1/A1 IO_L08P_1/A2 IO_L09N_1/LDC0 IO_L09P_1/HDC IO_L10N_1/LDC2 IO_L10P_1/LDC1 IP/VREF_1 ...

  • Page 182

    ... IO_L05P_3/LHCLK2 3 IO_L06N_3/LHCLK5 3 IO_L06P_3/LHCLK4/TRDY2 3 IO_L07N_3/LHCLK7 3 IO_L07P_3/LHCLK6 3 IO_L08N_3 3 IO_L08P_3 3 IO_L09N_3 3 IO_L09P_3 3 IO_L10N_3 3 IO_L10P_3 182 XC3S250E Pin Name IO_L08P_2/M0 IO_L09N_2/VS1/A18 IO_L09P_2/VS2/A19 IO_L10N_2/CCLK IO_L10P_2/VS0/A17 IP_L03N_2/VREF_2 IP_L03P_2 IP_L06N_2/M2/GCLK1 IP_L06P_2/RDWR_B/GCLK0 VCCO_2 VCCO_2 VCCO_2 IO/VREF_3 IO_L01N_3 IO_L01P_3 IO_L02N_3/VREF_3 IO_L02P_3 IO_L03N_3 IO_L03P_3 IO_L04N_3/LHCLK1 IO_L04P_3/LHCLK0 IO_L05N_3/LHCLK3 IO_L05P_3/LHCLK2 IO_L06N_3/LHCLK5 IO_L06P_3/LHCLK4 IO_L07N_3/LHCLK7 ...

  • Page 183

    ... VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT DS312-4 (v3.8) August 26, 2009 Product Specification XC3S250E Pin Name IP IP IP/VREF_3 VCCO_3 VCCO_3 GND GND GND GND GND GND GND GND GND GND GND GND ...

  • Page 184

    ... Some VREF and CLK pins are on INPUT pins. 2. The eight global clock pins in this bank have optional functionality during configuration and are counted in the DUAL column. Table 139: User I/Os Per Bank for the XC3S250E in TQ144 Package Package Maximum Edge I/O Bank ...

  • Page 185

    ... R TQ144 Footprint Note pin 1 indicator in top-left corner and logo orientation. Double arrows ( ) indicates a pinout migration difference between the XC3S100E and XC3S250E. PROG_B 1 IO_L01P_3 2 IO_L01N_3 3 IO_L02P_3 4 IO_L02N_3/VREF_3 IO_L03P_3 7 IO_L03N_3 8 VCCINT GND 11 IP/VREF_3 12 VCCO_3 13 IO_L04P_3/LHCLK0 14 IO_L04N_3/LHCLK1 15 IO_L05P_3/LHCLK2 16 IO_L05N_3/LHCLK3 GND 19 IO_L06P_3/LHCLK4 20 IO_L06N_3/LHCLK5 21 IO_L07P_3/LHCLK6 22 IO_L07N_3/LHCLK7 ...

  • Page 186

    ... Pinout Descriptions PQ208: 208-pin Plastic Quad Flat Package The 208-pin plastic quad flat package, PQ208, supports two different Spartan-3E FPGAs, including the XC3S250E and the XC3S500E. Table 141 lists all the PQ208 package pins. They are sorted by bank number and then by pin name. Pairs of pins that form a differential I/O pair appear together in the table ...

  • Page 187

    ... P78 DUAL/GCLK 3 P77 DUAL/GCLK 3 P83 DUAL/GCLK 3 P82 DUAL/GCLK 3 P87 DUAL 3 P86 DUAL 3 P90 I/O 3 www.xilinx.com Pinout Descriptions XC3S250E XC3S500E PQ208 Pin Name Pin IO_L13P_2 P89 IO_L14N_2/A22 P94 IO_L14P_2/A23 P93 IO_L15N_2/A20 P97 IO_L15P_2/A21 P96 IO_L16N_2/VS1/A18 P100 IO_L16P_2/VS2/A19 P99 IO_L17N_2/CCLK P103 IO_L17P_2/VS0/A17 P102 ...

  • Page 188

    ... GND P79 GND P85 GND P95 GND P105 GND P121 GND P131 GND P141 GND P156 GND P173 GND www.xilinx.com XC3S250E XC3S500E PQ208 Pin Name Pin GND P182 GND P188 GND P198 GND P208 DONE P104 PROG_B P1 TCK P158 TDI P207 ...

  • Page 189

    ... User I/Os by Bank Table 142 indicates how the 158 available user-I/O pins are distributed between the four I/O banks on the PQ208 pack- age. Table 142: User I/Os Per Bank for the XC3S250E and XC3S500E in the PQ208 Package Package Maximum Edge I/O Bank ...

  • Page 190

    Pinout Descriptions PQ208 Footprint (Left) PROG_B IO_L01P_3 IO_L01N_3 IO_L02P_3 IO_L02N_3/VREF_3 VCCAUX IO_L03P_3 IO_L03N_3 GND IO_L04P_3 11 IO_L04N_3 12 VCCINT IO_L05P_3 15 IO_L05N_3 16 GND IO_L06P_3 18 IO_L06N_3 19 IP/VREF_3 20 VCCO_3 21 IO_L07P_3/LHCLK0 IO_L07N_3/LHCLK1 IO_L08P_3/LHCLK2 IO_L08N_3/LHCLK3 GND IO_L09P_3/LHCLK4 IO_L09N_3/LHCLK5 IO_L10P_3/LHCLK6 ...

  • Page 191

    R PQ208 Footprint (Right) DS312-4 (v3.8) August 26, 2009 Product Specification Bank 0 Bank 2 Figure 85: PQ208 Footprint (Right) www.xilinx.com Pinout Descriptions 156 GND 155 TMS 154 IP 153 IO_L16N_1/LDC2 152 IO_L16P_1/LDC1 151 IO_L15N_1/LDC0 150 IO_L15P_1/HDC 149 VCCAUX 148 ...

  • Page 192

    ... FPGA application uses an I/O standard that requires a VREF voltage reference, connect the highlighted pin to the VREF voltage supply, even though this does not actually connect to the XC3S250E FPGA. This VREF connection on the board allows future migration to the larger devices with- out modifying the printed-circuit board. ...

  • Page 193

    ... R Table 143: FT256 Package Pinout (Continued) Bank XC3S250E Pin Name 0 IO_L12N_0 0 IO_L12P_0 IO_L14N_0/VREF_0 0 IO_L14P_0 0 IO_L15N_0 0 IO_L15P_0 0 IO_L17N_0/VREF_0 0 IO_L17P_0 0 IO_L18N_0 0 IO_L18P_0 0 IO_L19N_0/HSWAP 0 IO_L19P_0 IP_L02N_0 0 IP_L02P_0 0 IP_L07N_0 0 IP_L07P_0 0 IP_L10N_0/GCLK9 0 IP_L10P_0/GCLK8 0 IP_L16N_0 0 IP_L16P_0 0 VCCO_0 0 VCCO_0 0 VCCO_0 0 VCCO_0 1 IO_L01N_1/A15 1 IO_L01P_1/A16 1 IO_L02N_1/A13 1 IO_L02P_1/A14 DS312-4 (v3.8) August 26, 2009 ...

  • Page 194

    ... Pinout Descriptions Table 143: FT256 Package Pinout (Continued) Bank XC3S250E Pin Name 1 IO_L04N_1/VREF_1 1 IO_L04P_1 IO_L06N_1 1 IO_L06P_1 1 IO_L07N_1/A11 1 IO_L07P_1/A12 1 IO_L08N_1/VREF_1 1 IO_L08P_1 1 IO_L09N_1/A9/RHCLK1 1 IO_L09P_1/A10/RHCLK0 1 IO_L10N_1/A7/RHCLK3/ TRDY1 1 IO_L10P_1/A8/RHCLK2 1 IO_L11N_1/A5/RHCLK5 1 IO_L11P_1/A6/RHCLK4/ IRDY1 1 IO_L12N_1/A3/RHCLK7 1 IO_L12P_1/A4/RHCLK6 1 IO_L13N_1/A1 1 IO_L13P_1/A2 1 IO_L14N_1/A0 1 IO_L14P_1 1 IO_L15N_1 1 IO_L15P_1 1 IO_L16N_1 1 IO_L16P_1 IO_L18N_1/LDC0 ...

  • Page 195

    ... R Table 143: FT256 Package Pinout (Continued) Bank XC3S250E Pin Name IO/VREF_1 1 IP/VREF_1 1 VCCO_1 1 VCCO_1 1 VCCO_1 1 VCCO_1 IO/D5 2 IO/M1 2 IO/VREF_2 2 IO/VREF_2 2 IO_L01N_2/INIT_B 2 IO_L01P_2/CSO_B 2 IO_L03N_2/MOSI/CSI_B 2 IO_L03P_2/DOUT/BUSY 2 IO_L04N_2 2 IO_L04P_2 2 IO_L05N_2 2 IO_L05P_2 2 IO_L06N_2 2 IO_L06P_2 2 N. DS312-4 (v3.8) August 26, 2009 Product Specification XC3S500E Pin Name XC3S1200E Pin Name ...

  • Page 196

    ... Pinout Descriptions Table 143: FT256 Package Pinout (Continued) Bank XC3S250E Pin Name 2 N. IO_L09N_2/D6/GCLK13 2 IO_L09P_2/D7/GCLK12 2 IO_L10N_2/D3/GCLK15 2 IO_L10P_2/D4/GCLK14 2 IO_L12N_2/D1/GCLK3 2 IO_L12P_2/D2/GCLK2 2 IO_L13N_2/DIN/D0 2 IO_L13P_2/ IO_L15N_2 2 IO_L15P_2 2 IO_L16N_2/A22 2 IO_L16P_2/A23 2 IO_L18N_2/A20 2 IO_L18P_2/A21 2 IO_L19N_2/VS1/A18 2 IO_L19P_2/VS2/A19 2 IO_L20N_2/CCLK 2 IO_L20P_2/VS0/A17 IP_L02N_2 2 IP_L02P_2 2 IP_L08N_2/VREF_2 2 IP_L08P_2 2 IP_L11N_2/M2/GCLK1 2 IP_L11P_2/RDWR_B/ GCLK0 2 IP_L17N_2 2 IP_L17P_2 ...

  • Page 197

    ... R Table 143: FT256 Package Pinout (Continued) Bank XC3S250E Pin Name 3 IO_L01N_3 3 IO_L01P_3 3 IO_L02N_3/VREF_3 3 IO_L02P_3 3 IO_L03N_3 3 IO_L03P_3 IO_L05N_3 3 IO_L05P_3 3 IO_L06N_3 3 IO_L06P_3 3 IO_L07N_3 3 IO_L07P_3 3 IO_L08N_3/LHCLK1 3 IO_L08P_3/LHCLK0 3 IO_L09N_3/LHCLK3/ IRDY2 3 IO_L09P_3/LHCLK2 3 IO_L10N_3/LHCLK5 3 IO_L10P_3/LHCLK4/ TRDY2 3 IO_L11N_3/LHCLK7 3 IO_L11P_3/LHCLK6 3 IO_L12N_3 3 IO_L12P_3 3 IO_L13N_3 3 IO_L13P_3 IO_L15N_3 3 IO_L15P_3 3 IO_L16N_3 ...

  • Page 198

    ... Pinout Descriptions Table 143: FT256 Package Pinout (Continued) Bank XC3S250E Pin Name IO_L18N_3 3 IO_L18P_3 3 IO_L19N_3 3 IO_L19P_3 IP/VREF_3 3 IO/VREF_3 3 VCCO_3 3 VCCO_3 3 VCCO_3 3 VCCO_3 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND ...

  • Page 199

    ... R Table 143: FT256 Package Pinout (Continued) Bank XC3S250E Pin Name GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND VCCAUX ...

  • Page 200

    ... Pinout Descriptions User I/Os by Bank Table 144, Table 145, and Table 146 able user-I/O pins are distributed between the four I/O banks on the FT256 package. Table 144: User I/Os Per Bank on XC3S250E in the FT256 Package Package Maximum Edge I/O Bank Top 0 Right 1 ...