MCZ33905S5EK Freescale Semiconductor, MCZ33905S5EK Datasheet - Page 14

• Manufacturer Part Number: MCZ33905S5EK
• Description: IC SYSTEM BASIS CHIP GEN2 32SOIC
• Manufacturer: Freescale Semiconductor

Specifications of MCZ33905S5EK

• Applications: System Basis Chip
• Interface: CAN, LIN
• Voltage - Supply: 5.5 V ~ 27 V
• Package / Case: 32-SOIC (7.5mm Width) Exposed Pad, 32-eSOIC, 32-HSOIC
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table 3. Maximum Ratings (continued)
permanent damage to the device.
14
33903/4/5
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
THERMAL RATINGS4
THERMAL RESISTANCE
Notes
ESD Capability
Junction temperature
Ambient temperature
Storage temperature
Thermal resistance junction to ambient
Peak package reflow temperature during reflow
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
2.
3.
4.
5.
AECQ100
Tested per IEC 61000-4-2 (C
additional capacitor on VSUP1/VSUP2 pins
page
Tested per specific OEM EMC requirements for CAN and LIN with
ESD testing is performed in accordance with the Human Body Model (HBM) (C
(CDM), and Robotic (C
The voltage on non-VSUP pins should never exceed the V
soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
This parameter was measured according to
Charge Device Model - JESD22/C101 (C
Device unpowered, CANH and CANL pin without capacitor, versus GND
Device unpowered, LIN, LIN1 and LIN2 pin, versus GND
Device unpowered, VS1/VS2 (100 nF to GND), versus GND
Human Body Model - JESD22/A114 (C
CANH, CANL without bus filter
LIN, LIN1 and LIN2 with and without bus filter
I/O with external components (22 k - 10 nF)
86)
(2)
all other Pins including CANH and CANL
Corner Pins (Pins 1, 16, 17, and 32)
CANH and CANL. LIN1 and LIN2, Pins versus all GND pins
All other Pins (Pins 2-15, 18-31)
Figure 10. PCB with Top and Bottom Layer Dissipation Area (Dual Layer)
ZAP
PCB 100mm x 100mm
ZAP
= 4.0 pF).
Ratings
= 150 pF, R
ZAP
(2),
ZAP
ZAP
(See Typical Applications on
(4)
Figure
= 100 pF, R
= 330 Ω)
= 4.0 pF)
10:
ZAP
SUP
= 1500 Ω)
Top side, 300 sq. mm
(20mmx15mm)
voltage at any time or permanent damage to the device may occur. Pin
Bottom side
20mm x 40mm
ZAP
V
V
V
V
V
V
V
V
V
V
Symbol
T
ESD1-1
ESD1-2
ESD2-1
ESD2-2
ESD3-1
ESD3-2
ESD3-3
ESD4-1
ESD4-2
ESD4-3
R
T
PPRT
= 100 pF, R
T
T
θJA
ST
A
J
Bottom view
Analog Integrated Circuit Device Data
ZAP
= 1500 Ω), the Charge Device Model
-40 to 125
-55 to 165
±15000
±15000
±15000
±12000
±8000
±2000
±9000
±7000
Value
Note 4
±750
±500
50
150
(5)
Freescale Semiconductor
°C/W
Unit
°C
°C
°C
°C
V