uja1061 NXP Semiconductors, uja1061 Datasheet - Page 68

• Manufacturer Part Number: uja1061
• Description: Low Speed Can/lin System Basis Chip
• Manufacturer: NXP Semiconductors

NXP Semiconductors
12. Package outline
Fig 28. Package outline SOT 549-1 (HTSSOP32)
UJA1061_5
Product data sheet
HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
E h
VERSION
OUTLINE
SOT549-1
max.
32
1.1
1
A
Z
y
pin 1 index
0.15
0.05
A 1
0.95
0.85
A 2
IEC
0.25
A 3
exposed die pad side
e
0.30
0.19
b p
D h
D
0.20
0.09
c
MO-153
JEDEC
11.1
10.9
D
(1)
REFERENCES
Rev. 05 — 22 November 2007
0
D h
5.1
4.9
E
6.2
6.0
b
(2)
p
JEITA
scale
17
16
2.5
E h
3.6
3.4
Fault-tolerant CAN/LIN fail-safe system basis chip
w
c
M
0.65
e
A 2
5 mm
A 1
H E
8.3
7.9
L
1
0.75
0.50
L p
H E
E
PROJECTION
EUROPEAN
detail X
0.2
v
L
L
0.1
p
w
© NXP B.V. 2007 Nov 23. All rights reserved.
UJA1061
(A 3 )
0.1
y
A
ISSUE DATE
03-04-07
05-11-02
0.78
0.48
X
Z
SOT549-1
A
v
M
8
0
o
68 of 74
o
A