uja1061 NXP Semiconductors, uja1061 Datasheet - Page 70

• Manufacturer Part Number: uja1061
• Description: Low Speed Can/lin System Basis Chip
• Manufacturer: NXP Semiconductors

NXP Semiconductors
UJA1061_5
Product data sheet
13.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 28.
Table 29.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 28
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
29
Rev. 05 — 22 November 2007
29.
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
Fault-tolerant CAN/LIN fail-safe system basis chip
3
3
)
)
Figure
350 to 2000
260
250
245
29) than a PbSn process, thus
220
220
350
© NXP B.V. 2007 Nov 23. All rights reserved.
> 2000
260
245
245
UJA1061
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