uja1061 NXP Semiconductors, uja1061 Datasheet - Page 74

• Manufacturer Part Number: uja1061
• Description: Low Speed Can/lin System Basis Chip
• Manufacturer: NXP Semiconductors

NXP Semiconductors
13
13.1
13.2
13.3
13.4
14
15
15.1
15.2
15.3
15.4
16
17
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 71
Legal information. . . . . . . . . . . . . . . . . . . . . . . 72
Contact information. . . . . . . . . . . . . . . . . . . . . 72
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Introduction to soldering . . . . . . . . . . . . . . . . . 69
Wave and reflow soldering . . . . . . . . . . . . . . . 69
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 69
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 70
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 72
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007 Nov 23.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Fault-tolerant CAN/LIN fail-safe system basis chip
Date of release: 22 November 2007
Document identifier: UJA1061_5
UJA1061
All rights reserved.