uja1061 NXP Semiconductors, uja1061 Datasheet - Page 71

• Manufacturer Part Number: uja1061
• Description: Low Speed Can/lin System Basis Chip
• Manufacturer: NXP Semiconductors

NXP Semiconductors
14. Revision history
Table 30.
UJA1061_5
Product data sheet
Document ID
UJA1061_5
Modifications:
UJA1061_4
Modifications:
UJA1061_3
UJA1061_2
(9397 750 14201)
UJA1061_1
(9397 750 11708)
Revision history
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Fig 29. Temperature profiles for large and small components
Release date
20071122
20070427
20060627
20051122
20040322
•
•
•
•
•
•
•
•
•
•
•
•
Table
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors
Legal texts have been adapted to the new company name where appropriate
Added
Added
Various values changed to latest test results
Various minor changes in texts, symbols and figures
Section
Table
General test conditions: added requirement for V
Pin BAT42: added new values for V
Added ESD performance according to IEC 61000-4-2
MSL: Moisture Sensitivity Level
temperature
26: updated conditions for IV
9: updated CANIE and LINIE function descriptions
Section 8
Figure 15
6.10: changed Level WAKE Status (LWS) to WAKE Level Status (WLS)
Data sheet status
Product data sheet
Product data sheet
Preliminary data sheet
Objective data sheet
Objective specification
Rev. 05 — 22 November 2007
and
and
= minimum soldering temperature
Section 11
Figure 16
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
to
Fault-tolerant CAN/LIN fail-safe system basis chip
22
1
BAT42
= 5.5 V to 8.1 V
Change notice
-
-
-
-
-
BAT42
V
BAT14
temperature
Supersedes
UJA1061_4
UJA1061_3
UJA1061_2
UJA1061_1
-
peak
1 V
© NXP B.V. 2007 Nov 23. All rights reserved.
UJA1061
001aac844
time
71 of 74