PIC32MX460F512L-80I/PT Microchip Technology, PIC32MX460F512L-80I/PT Datasheet - Page 586

• Manufacturer Part Number: PIC32MX460F512L-80I/PT
• Description: IC PIC MCU FLASH 512K 100-TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 32MXr

Specifications of PIC32MX460F512L-80I/PT

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 100-TFQFP
• Core Processor: MIPS32® M4K™
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: I²C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 85
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.3 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC32MX4xx
• Core: MIPS
• Data Bus Width: 32 bit
• Data Ram Size: 32 KB
• Interface Type: I2C , SPI , UART
• Maximum Clock Frequency: 80 MHz
• Number Of Programmable I/os: 85
• Number Of Timers: 5 x 16 bit, 1 x 32 bit
• Operating Supply Voltage: 2.3 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, DM320003, DM320002, MA320002
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit
• Controller Family/series: PIC32
• No. Of I/o's: 85
• Ram Memory Size: 32KB
• Cpu Speed: 80MHz
• No. Of Timers: 6
• Embedded Interface Type: EUART, I2C, PSP, SPI
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1000 - PIC32 BREAKOUT BOARDAC244003 - TEST BD MPLAB REAL ICE LOOPBACKDM320003 - BOARD DEMO USB PIC32 OTGAC244006 - KIT MPLAB REAL ICE TRACEAC164333 - MODULE SKT FOR PM3 100QFP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC32MX3XX/4XX
30.1
TABLE 30-1:
TABLE 30-2:
TABLE 30-3:
TABLE 30-4:
DS61143C -page 584
DC CHARACTERISTICS
Operating Voltage
DC10
DC12
DC16
DC17
Legend: TBD = To Be Determined
Note 1:
DC5
Note 1:
PIC32MX3XX/4XX
Power Dissipation:
Internal Chip Power Dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 100-Pin TQFP (12x12x1 mm)
Package Thermal Resistance, 64-Pin TQFP (10x10x1 mm)
Note 1:
Characteristic
Param
No.
2:
Operating Junction Temperature Range
DC Characteristics
P
I/O = S ({V
Operating Ambient Temperature Range
Supply Voltage
V
V
V
S
Symbol
INT
DD
DR
POR
VDD
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
This is the limit to which V
40 MHz maximum for PIC32MX 40MHz family variants.
Junction to ambient thermal resistance, Theta-
= V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
RAM Data Retention Voltage
V
to Ensure Internal
Power-on Reset Signal
V
to Ensure Internal
Power-on Reset Signal
DD
x (I
DD
DD
– V
V
DD
Start Voltage
Rise Rate
(in Volts)
DD
2.3-3.6V
OH
Characteristic
– S I
Range
Characteristic
} x I
Rating
OH
OH
)
) + S (V
DD
can be lowered without losing RAM data.
OL
x I
OL
(2)
Preliminary
-40°C to +85°C
) )
Temp Range
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature
(in °C)
0.05
Min
2.3
—
—
JA
(
θ
JA
) numbers are achieved by package simulations.
Typ
TBD
V
—
—
SS
Symbol
Symbol
P
(1)
DMAX
θ
θ
P
T
T
JA
JA
A
D
J
Max
3.6
—
—
—
-40°C ≤ T
52.3
38.3
Min
Typ
-40
-40
Units
V/ms
V
V
V
(T
PIC32MX3XX/4XX
© 2008 Microchip Technology Inc.
P
Max Frequency
A
J
INT
– T
≤ +85°C for Industrial
Max
Typ
80 MHz
—
—
—
—
+ P
A
)/θ
I
/
O
JA
Conditions
(1)
°C/W
°C/W
+125
Max
Unit
+85
Notes
Unit
°C
°C
W
W
1
1