DF2268FA13V Renesas Electronics America, DF2268FA13V Datasheet - Page 588

IC H8S/2268 MCU FLASH 100QFP

DF2268FA13V

Manufacturer Part Number
DF2268FA13V
Description
IC H8S/2268 MCU FLASH 100QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheets

Specifications of DF2268FA13V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
13MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
LCD, POR, PWM, WDT
Number Of I /o
67
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2268FA13V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 20 ROM
Rev. 5.00 Sep. 01, 2009 Page 536 of 656
REJ09B0071-0500
V
FWE
MD2,MD1 *
RES
SWE1 bit
φ
Notes:
CC
Period during which flash memory access is prohibited
(t
Period during which flash memory can be programmed
(Execution of program in flash memory prohibited, and data reads other than verify operations
prohibited)
sswe
1.
2.
3.
Except when switching modes, the level of the mode pins (MD2, MD1) must be fixed until
power-off by pulling the pins up or down.
See section 25.2.8, Flash Memory Characteristics.
Mode programming setup time t
1
Figure 20.14 Power-On/Off Timing (User Program Mode)
: Wait time after setting SWE1 bit) *
t
OSC1
t
MDS
SWE1 set
Wait time:
*
3
MDS
(min.) = 200ns.
2
t
sswe
Programming/
erasing
possible
Wait time:
SWE1 cleared
100µs
min 0µs

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