DF2377RVFQ33W Renesas Electronics America, DF2377RVFQ33W Datasheet - Page 1144
DF2377RVFQ33W
Manufacturer Part Number
DF2377RVFQ33W
Description
IC H8S MCU FLASH 3V 384K 144LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet
1.YR0K42378FC000BA.pdf
(1208 pages)
Specifications of DF2377RVFQ33W
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2377RVFQ33W
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Company:
Part Number:
DF2377RVFQ33WV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Section 26 Electrical Characteristics
Rev.7.00 Mar. 18, 2009 page 1076 of 1136
REJ09B0109-0700
Read
φ
A23 to A6,
A0
A5 to A1
CS7 to CS0
AS
RD
D15 to D0
HWR, LWR
Figure 26.13 Burst ROM Access Timing: Two-State Burst Access
T
1
T
2
T
3
t
AD
T
1
t
AS1
t
t
AA3
ASD
t
ASD
T
2
t
RDS2
t
AH1
t
RDH2
t
RSD2
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