DF2377RVFQ33W Renesas Electronics America, DF2377RVFQ33W Datasheet - Page 320

IC H8S MCU FLASH 3V 384K 144LQFP

DF2377RVFQ33W

Manufacturer Part Number
DF2377RVFQ33W
Description
IC H8S MCU FLASH 3V 384K 144LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2377RVFQ33W

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2377RVFQ33W
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
DF2377RVFQ33WV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 6 Bus Controller (BSC)
Relationship between Chip Select (CS) Signal and Read (RD) Signal: Depending on the
system’s load conditions, the RD signal may lag behind the CS signal. An example is shown in
figure 6.68. In this case, with the setting for no idle cycle insertion (a), there may be a period of
overlap between the bus cycle A RD signal and the bus cycle B CS signal. Setting idle cycle
insertion, as in (b), however, will prevent any overlap between the RD and CS signals. In the
initial state after reset release, idle cycle insertion (b) is set.
Rev.7.00 Mar. 18, 2009 page 252 of 1136
REJ09B0109-0700
Address bus
CS (area A)
CS (area B)
Figure 6.68 Relationship between Chip Select (CS) and Read (RD)
RD
Overlap period between CS (area B)
and RD may occur
φ
(a) No idle cycle insertion
T
(ICIS1 = 0)
1
Bus cycle A
T
2
T
3
Bus cycle B
T
1
T
2
Address bus
CS (area A)
CS (area B)
RD
φ
T
(b) Idle cycle insertion
1
Bus cycle A
(ICIS1 = 1, initial value)
T
2
T
3
Idle cycle
T
i
Bus cycle B
T
1
T
2

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