DF2377RVFQ33W Renesas Electronics America, DF2377RVFQ33W Datasheet - Page 337
DF2377RVFQ33W
Manufacturer Part Number
DF2377RVFQ33W
Description
IC H8S MCU FLASH 3V 384K 144LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet
1.YR0K42378FC000BA.pdf
(1208 pages)
Specifications of DF2377RVFQ33W
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
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Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2377RVFQ33W
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Company:
Part Number:
DF2377RVFQ33WV
Manufacturer:
Renesas Electronics America
Quantity:
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Section 6 Bus Controller (BSC)
On-chip memory read Internal I/O register read
External write cycle
T
T
T
T
T
1
2
W
W
3
φ
Internal address bus
Internal memory
Internal I/O register address
Internal read signal
External address
A23 to A0
CSn
External space
write
HWR, LWR
D15 to D0
Figure 6.83 Example of Timing when Write Data Buffer Function Is Used
6.11
Bus Release
This LSI can release the external bus in response to a bus request from an external device. In the
external bus released state, internal bus masters except the EXDMAC * continue to operate as long
as there is no external access. If any of the following requests are issued in the external bus
released state, the BREQO signal can be driven low to output a bus request externally.
• When an internal bus master wants to perform an external access
• When a refresh request is generated
• When a SLEEP instruction is executed to place the chip in software standby mode or all-
module-clocks-stopped mode
Note: * Not supported by the H8S/2375, H8S/2375R, H8S/2373, and H8S/2373R.
Rev.7.00 Mar. 18, 2009 page 269 of 1136
REJ09B0109-0700
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