DF2377RVFQ33W Renesas Electronics America, DF2377RVFQ33W Datasheet - Page 411
DF2377RVFQ33W
Manufacturer Part Number
DF2377RVFQ33W
Description
IC H8S MCU FLASH 3V 384K 144LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet
1.YR0K42378FC000BA.pdf
(1208 pages)
Specifications of DF2377RVFQ33W
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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A byte or word transfer is performed for a single transfer request, and after the transfer, the bus is
released. While the bus is released, one or more bus cycles are executed by the CPU or DTC.
In the transfer end cycle (the cycle in which the transfer counter reaches 0), a one-state DMA dead
cycle is inserted after the DMA write cycle.
DREQ Pin Falling Edge Activation Timing: Set the DTA bit in DMABCRH to 1 for the channel
for which the DREQ pin is selected.
Figure 7.30 shows an example of single address mode transfer activated by the DREQ pin falling
edge.
Address bus
DACK
TEND
HWR
LWR
φ
Figure 7.29 Example of Single Address Mode Transfer (Word Write)
release
Bus
DMA write
release
Bus
DMA write
Rev.7.00 Mar. 18, 2009 page 343 of 1136
release
Bus
Section 7 DMA Controller (DMAC)
Last transfer
DMA write
cycle
REJ09B0109-0700
DMA
dead
release
Bus
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