DF2377RVFQ33W Renesas Electronics America, DF2377RVFQ33W Datasheet - Page 282

• Manufacturer Part Number: DF2377RVFQ33W
• Description: IC H8S MCU FLASH 3V 384K 144LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2377RVFQ33W

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 97
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 6x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 6 Bus Controller (BSC)
When DDS = 1 or EDDS = 1: Burst access is performed by determining the address only,
irrespective of the bus master. With the DRAM interface, the DACK or EDACK output goes low
from the T
Figure 6.41 shows the DACK or EDACK output timing for the DRAM interface when DDS = 1 or
EDDS = 1.
Rev.7.00 Mar. 18, 2009 page 214 of 1136
REJ09B0109-0700
Figure 6.41 Example of DACK/EDACK Output Timing when DDS = 1 or EDDS = 1
Read
Write
Note: n = 2 to 5
c1
DACK or EDACK
state.
φ
Address bus
RASn (CSn)
UCAS, LCAS
WE (HWR)
OE (RD)
Data bus
WE (HWR)
OE (RD)
Data bus
(RAST = 0, CAST = 0)
T
p
Row address
High
High
T
r
T
c1
Column address
T
c2