DSPIC33FJ128MC804-H/ML Microchip Technology, DSPIC33FJ128MC804-H/ML Datasheet - Page 21

• Manufacturer Part Number: DSPIC33FJ128MC804-H/ML
• Description: 16-bit DSC, 128KB Flash, Motor, CAN, DMA, 40 MIPS, NanoWatt 44 QFN 8x8x0.9mm TUB
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ128MC804-H/ML

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 35
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 9x10b/12b, D/A 6x16b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 140°C
• Package / Case: 44-QFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

2.0
2.1
Getting started with the dsPIC33FJ32MC302/304,
dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/
X04 family of 16-bit Digital Signal Controllers (DSC)
requires attention to a minimal set of device pin
connections before proceeding with development. The
following is a list of pin names, which must always be
connected:
• All V
• All AV
• V
• MCLR pin
• PGECx/PGEDx pins used for In-Circuit Serial
• OSC1 and OSC2 pins when external oscillator
Additionally, the following pins may be required:
• V
© 2011 Microchip Technology Inc.
dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04
(see
is not used)
(see
(see
Connection (V
(see
Programming™ (ICSP™) and debugging purposes
(see
source is used
(see
reference for ADC module is implemented
Note:
Note 1: This data sheet summarizes the features
CAP
REF
DD
Section 2.2 “Decoupling
Section 2.2 “Decoupling
Section 2.3 “CPU Logic Filter Capacitor
Section 2.4 “Master Clear (MCLR)
Section 2.5 “ICSP
Section 2.6 “External Oscillator
+/V
DD
2: Some registers and associated bits
GUIDELINES FOR GETTING
STARTED WITH 16-BIT
DIGITAL SIGNAL
CONTROLLERS
Basic Connection Requirements
and V
REF
and AV
The AV
connected independent of the ADC
voltage reference source.
of
dsPIC33FJ64MCX02/X04
dsPIC33FJ128MCX02/X04
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to the “dsPIC33F/PIC24H
Family Reference Manual”. Please see
the
(www.microchip.com)
dsPIC33F/PIC24H
Manual sections.
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization”
this data sheet for device-specific register
and bit information.
- pins used when external voltage
SS
CAP
SS
pins
the
DD
)”)
pins (regardless if ADC module
Microchip
and AV
Pins”)
dsPIC33FJ32MC302/304,
SS
Family
Capacitors”)
Capacitors”)
for
pins must be
web
Pins”)
the
family
Reference
Pin”)
latest
and
site
of
in
2.2
The use of decoupling capacitors on every pair of
power supply pins, such as V
AV
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: Recommendation
• Placement on the printed circuit board: The
• Handling high frequency noise: If the board is
• Maximizing performance: On the board layout
of 0.1 µF (100 nF), 10-20V. This capacitor should
be a low-ESR and have resonance frequency in
the range of 20 MHz and higher. It is
recommended that ceramic capacitors be used.
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within
one-quarter inch (6 mm) in length.
experiencing high frequency noise, upward of
tens of MHz, add a second ceramic-type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum thereby reducing PCB track inductance.
SS
is required.
Decoupling Capacitors
DD
, V
DS70291E-page 21
SS
, AV
DD
and