DSPIC33FJ128MC804-H/ML Microchip Technology, DSPIC33FJ128MC804-H/ML Datasheet - Page 344

16-bit DSC, 128KB Flash, Motor, CAN, DMA, 40 MIPS, NanoWatt 44 QFN 8x8x0.9mm TUB

DSPIC33FJ128MC804-H/ML

Manufacturer Part Number
DSPIC33FJ128MC804-H/ML
Description
16-bit DSC, 128KB Flash, Motor, CAN, DMA, 40 MIPS, NanoWatt 44 QFN 8x8x0.9mm TUB
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheet

Specifications of DSPIC33FJ128MC804-H/ML

Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
35
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 9x10b/12b, D/A 6x16b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 140°C
Package / Case
44-QFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04
31.1
TABLE 31-1:
TABLE 31-2:
TABLE 31-3:
DS70291E-page 344
Characteristic
Industrial Temperature Devices
Extended Temperature Devices
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 44-pin QFN
Package Thermal Resistance, 44-pin TFQP
Package Thermal Resistance, 28-pin SPDIP
Package Thermal Resistance, 28-pin SOIC
Package Thermal Resistance, 28-pin QFN-S
Note 1:
I/O = Σ ({V
DC Characteristics
P
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
INT
Junction to ambient thermal resistance, Theta-
= V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DD
x (I
– V
V
DD
(in Volts)
DD
3.0-3.6V
3.0-3.6V
OH
Characteristic
– Σ I
Range
} x I
Rating
OH
OH
)
) + Σ (V
OL
x I
OL
-40°C to +125°C
)
-40°C to +85°C
Temp Range
(in °C)
JA
(
θ
JA
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX
θ
θ
θ
θ
θ
P
T
T
T
T
JA
JA
JA
JA
JA
A
A
D
J
J
Min
Typ
dsPIC33FJ64MCX02/X04 and
-40
-40
-40
-40
30
40
45
50
30
dsPIC33FJ128MCX02/X04
dsPIC33FJ32MC302/304,
(T
P
© 2011 Microchip Technology Inc.
INT
J
– T
Max
Typ
Max MIPS
+ P
A
)/θ
40
40
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+155
+125
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1

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