GD82559C S L3DF Intel, GD82559C S L3DF Datasheet - Page 106

• Manufacturer Part Number: GD82559C S L3DF
• Manufacturer: Intel

Specifications of GD82559C S L3DF

• Lead Free Status / Rohs Status: Not Compliant

82559 — Networking Silicon
98
Table 28. PCI/CardBus Interface DC Specifications
Table 29. SMB Interface DC Specifications
Table 30. Flash/Modem/EEPROM Interface DC Specifications
NOTES:
NOTE: SMB outputs (SMBALRT#, SMBD, and SMBCLK) are open drain.
NOTE:
1. These values are only applicable in 3.3 V signaling environments (PCI or CardBus). Outside of this limit the
2. Input leakage currents include high-Z output leakage for all bidirectional buffers with tristate outputs.
3. Signals without pull-up resistors have 3 mA low output current; and signals requiring pull-up resistors, 6 mA.
4. This value is characterized but not tested.
1. This value is characterized but not tested.
V
V
C
C
C
L
V
V
I
V
V
V
I
V
V
C
ILS
ILL
PINP
OHP
OLP
Symbol
IHS
ILS
OLS
Symbol
IHL
ILL
OHL
OLL
INP
CLKP
IDSEL
INL
input buffer must consume its minimum current.
The signals requiring pull-up resistors include: FRAME#, TRDY#, IRDY#, DEVSEL#, STOP#, SERR# and
PERR#.
Output High Voltage
Output Low Voltage
Input Pin Capacitance
CLK Pin Capacitance
IDSEL Pin Capacitance
Pin Inductance
Input High Voltage
Input Low Voltage
Input Low Leakage
Current
Output Low Voltage
Input High Voltage
Input Low Voltage
Input Low Leakage
Current
Output High Voltage
Output Low Voltage
Input Pin Capacitance
Parameter
Parameter
I
I
I
I
I
I
0 < V
I
0 < V
I
I
out
out
out
out
out
out
PULLUP
out
out
= -2 mA
= -500 µA
= -150 µA
= 3 mA, 6 mA
= 1500 µA
= 700 µA
= -1 mA
= 2mA
in
in
Condition
Condition
< V
< V
= 100 µA
CC
CC
0.9V
0.9V
Min
-0.5
Min
-0.5
2.4
1.4
2.0
2.4
5
CC
CC
V
V
0.1V
0.1V
CC
IO
Max
Max
0.55
±1.0
±20
0.6
0.4
0.8
0.4
10
12
12
10
8
+ 0.5
+ 0.5
CC
CC
Units
Units
nH
pF
pF
pF
µA
µA
pF
V
V
V
V
V
V
V
V
V
V
V
V
V
CardBus
CardBus
3, PCI
Notes
Notes
Datasheet
PCI
4
4
4
4
1